29,99 €
inkl. MwSt.
Versandkostenfrei*
Versandfertig in 1-2 Wochen
payback
15 °P sammeln
  • Broschiertes Buch

Adhesive dentistry has been progressing with rapid pace over the past decade. Inspite of it being in use since a decade still failure cases are seen, which are mainly due to polymerization shrinkage of composite and subsequent inadequate adhesion to cavity walls, leading to microleakage. Various generations of dentin bonding agents have been introduced to overcome these shortcomings.Simplification has been achieved by introducing dual cured and self-cured bonding agent called the 8th generation dentin bonding agent. It works both in self-cure and light cure mode. It is new single dose delivery…mehr

Produktbeschreibung
Adhesive dentistry has been progressing with rapid pace over the past decade. Inspite of it being in use since a decade still failure cases are seen, which are mainly due to polymerization shrinkage of composite and subsequent inadequate adhesion to cavity walls, leading to microleakage. Various generations of dentin bonding agents have been introduced to overcome these shortcomings.Simplification has been achieved by introducing dual cured and self-cured bonding agent called the 8th generation dentin bonding agent. It works both in self-cure and light cure mode. It is new single dose delivery system and prevents solvent evaporation; a common problem in a variety of other bonding systems. It ensures an immediate stick effect which guarantees that the bond will not be blown out of the cavity while air drying. This ensures a superior marginal integrity and protection against sensitivities.
Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Autorenporträt
Sameksha Arora has graduated (BDS) from Santosh Dental college, Ghaziabad and post graduated (MDS) from DJ college of dental sciences and research, Modinagar. She has conducted two researches and five presentations at national conferences. With an admirable perseverance she determines to ride knowledge wheel.