Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators

Herausgegeben:Gusev, Evgeni; Garfunkel, Eric; Dideikin, Arthur

• Broschiertes Buch

Produktbeschreibung

A NATO Advanced Research Workshop (ARW) entitled "Advanced Materials and Technologies for Micro/Nano Devices, Sensors and Actuators" was held in St. Petersburg, Russia, from June 29 to July 2, 2009. The main goal of the Workshop was to examine (at a fundamental level) the very complex scientific issues that pertain to the use of micro- and nano-electromechanical systems (MEMS and NEMS), devices and technologies in next generation commercial and defen- related applications. Micro- and nano-electromechanical systems represent rather broad and diverse technological areas, such as optical systems (micromirrors, waveguides, optical sensors, integrated subsystems), life sciences and lab equipment (micropumps, membranes, lab-on-chip, membranes, microfluidics), sensors (bio-sensors, chemical sensors, gas-phase sensors, sensors integrated with electronics) and RF applications for signal transmission (variable capacitors, tunable filters and antennas, switches, resonators). From a scientific viewpoint, this is a very multi-disciplinary field, including micro- and nano-mechanics (such as stresses in structural materials), electronic effects (e. g. charge transfer), general electrostatics, materials science, surface chemistry, interface science, (nano)tribology, and optics. It is obvious that in order to overcome the problems surrounding next-generation MEMS/NEMS devices and applications it is necessary to tackle them from different angles: theoreticians need to speak with mechanical engineers, and device engineers and modelers to listen to surface physicists. It was therefore one of the main objectives of the workshop to bring together a multidisciplinary team of distinguished researchers.

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Produktdetails

• NATO Science for Peace and Security Series B: Physics and Biophysics
• Verlag: Springer / Springer Netherlands
• Artikelnr. des Verlages: 12792269, 978-90-481-3806-7
• 1st Edition.
• Seitenzahl: 314
• Erscheinungstermin: 30. Juni 2010
• Englisch
• Abmessung: 237mm x 158mm x 20mm
• Gewicht: 507g
• ISBN-13: 9789048138067
• ISBN-10: 904813806X
• Artikelnr.: 27810697

Inhaltsangabe

MEMS/NEMS Technologies and Applications.- History of Early Research on MEMS in Russia (U.S.S.R.).- Challenges of Complete CMOS/MEMS Systems Integration.- MEMS for Practical Applications.- Nanochip: A MEMS-Based Ultra-High Data Density Memory Device.- Low Cost Silicon Coriolis' Gyroscope Paves the Way to Consumer IMU.- Microwave and Millimetre Wave Devices Based on Micromachining of III-V Semiconductors.- Monocrystalline-Silicon Microwave MEMS Devices.- Three-Dimensional Photonic Crystals Based on Opal-Semiconductor and Opal-Metal Nanocomposites.- MEMS Device and Reliability Physics.- Pull-in Dynamics of Electrostatically Actuated Bistable Micro Beams.- Path Following and Numerical Continuation Methods for Non-Linear MEMS and NEMS.- The Impact of Dielectric Material and Temperature on Dielectric Charging in RF MEMS Capacitive Switches.- Advanced Processes and Materials.- Development of DRIE for the Next Generation of MEMS Devices.- Low-Temperature Processes for MEMS Device Fabrication.- High-Temperature Stable Au-Sn and Cu-Sn Interconnects for 3D Stacked Applications.- 3D Integration of MEMS and IC: Design, Technology and Simulations.- Low-Frequency Electronic Noise in the Back-Gated and Top-Gated Graphene Devices.- Modeling of Dry Etching in Production of MEMS.- XRD and Raman Study of Low Temperature AlGaAs/GaAs (100) Heterostructures.- Internal Stresses in Martensite Formation in Copper Based Shape Memory Alloys.- Sensors.- Smart Sensors: Advantages and Pitfalls.- Vertically Integrated MEMS SOI Composite Porous Silicon-Crystalline Silicon Cantilever-Array Sensors: Concept for Continuous Sensing of Explosives and Warfare Agents.- Integration of Diverse Biological Materials in Micro/Nano Devices.- Force Sensing Optimization and Applications.- Using ParametricResonance to Improve Micro Gyrsocope Robustness.