Advanced Packaging For Microelectronic and Microsystem Applications - Anderson, Travis
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The emergence of GaN-based devices promises a revolution in areas requiring high performance electronics, such as high speed earth and space-based communication systems, advanced radar, integrated sensors, high temperature electronics, and utility power switching. The properties of this system make it ideally suited for operation at elevated temperatures and at voltage and current levels well beyond that accessible by Si. Recent improvements in material quality and device performance are rapidly opening the door to commercialization, and III-N technologies are demonstrating exciting…mehr

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Produktbeschreibung
The emergence of GaN-based devices promises a
revolution in areas requiring high performance
electronics, such as high speed earth and space-based
communication systems, advanced radar, integrated
sensors, high temperature electronics, and utility
power switching. The properties of this system make
it ideally suited for operation at elevated
temperatures and at voltage and current levels well
beyond that accessible by Si. Recent improvements in
material quality and device performance are rapidly
opening the door to commercialization, and III-N
technologies are demonstrating exciting developments
of late. Though devices are entering
commercialization, there are still considerable
unknowns, particularly in the reliability field.
Recent advances at the University of Florida will be
detailed in this work.
Autorenporträt
Travis Anderson, a native of Miami, Florida, began his higher
education at the Georgia Institute of Technology. He then
enrolled in the Ph.D. program in at the University of Florida,
joining Dr. Fan Ren s group. His research has focused on the
maturation of GaN technology, studying novel sensors and
transistors, system integration, and reliability.