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Current and future trends in the development of chip sets for 3G and 4G mobile handhelds call for achieving the highest performance/price ratio which means the development of feature-rich multi-mode wireless devices while maintaining the cost of adding more features at a minimum. In this book, a novel compact wireless radio transceiver architecture reusing a baseband chain so as to significantly reduce the die area is proposed. To realize a high performance direct conversion receiver for multi-mode wireless communications, certain limiting factors in the design should be identified and removed…mehr

Produktbeschreibung
Current and future trends in the development of chip
sets for 3G and 4G mobile handhelds call for
achieving the highest performance/price ratio which
means the development of feature-rich multi-mode
wireless devices while maintaining the cost of adding
more features at a minimum. In this book, a novel
compact wireless radio transceiver architecture
reusing a baseband chain so as to significantly
reduce the die area is proposed. To realize a high
performance direct conversion receiver for multi-mode
wireless communications, certain limiting factors in
the design should be identified and removed or
mitigated. One of the main factors addressed in this
book is the DC offset problem. Generation mechanisms
for DC offsets, both static and dynamic, are modeled
and DC offset cancellation schemes are proposed. The
design of an analog baseband chain for the proposed
compact wireless transceiver is also presented. This
book is intended for radio and mixed-signal IC
designers, graduate students in electrical and
computer engineering as well as marketing and product
managers of wireless chip sets.
Autorenporträt
Seok-Bae Park, PhD: Studied Electrical Engineering at Seoul
National University, Seoul, Korea and Ohio State University,
Columbus, Ohio, Senior RF and Mixed-Signal Design Engineer at
Firstpass Technologies, Dublin, Ohio; Mohammed Ismail, PhD:
Professor and Founding Director of Analog VLSI Lab, Ohio State
University, Fellow of IEEE.