Deborah D L Chung

Applied Materials Science

Applications of Engineering Materials in Structural, Electronics, Thermal, and Other Industries

• Gebundenes Buch

Produktbeschreibung

If you work or teach those that aspire to work in an engineering capacity, you will find no text or reference that better prepares its readers for real-world applications of engineering materials.

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Materials are the foundation of technology. As such, most universities provide engineering students with the basic concepts of materials science, but few offer the applications-oriented background that students need to succeed in industry. This book fills that gap. From a cross-disciplinary perspective, the author examines the practical applications of engineering materials across a broad range of industries. The topics addressed include electronic packaging, smart materials, thermal management, and materials development. Designed for use as both a text and a reference, Applied Materials Science is both scientifically rich and technologically relevant.

Produktdetails

• Verlag: Taylor & Francis Ltd (Sales)
• Seitenzahl: 252
• Erscheinungstermin: 13. Juni 2001
• Englisch
• Abmessung: 241mm x 163mm x 5mm
• Gewicht: 485g
• ISBN-13: 9780849310737
• ISBN-10: 0849310733
• Artikelnr.: 21397086

Autorenporträt

Chung, Deborah D. L.

Inhaltsangabe

Introduction to Materials Applications. Materials for Thermal Conduction.
Polymer-Matrix Composites for Microelectronics. Materials for
Electromagnetic Interference Shielding. Cement-Based Electronics.
Self-Sensing of Carbon Fiber Polymer-Matrix Structural Composites.
Structural Health Monitoring by Electrical Resistance Measurement.
Modification of the Surface of Carbon Fibers for Use as a Reinforcement in
Composite Materials. Corrosion Control of Steel Reinforced Concrete.
Applications of Submicron Diameter Carbon Filaments. Improving Cement-Based
Materials by Using Silica Fume. Appendices.