Big Data Analytics for Cyber-Physical Systems
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This book highlights research and survey articles dedicated to big data techniques for cyber-physical system (CPS), which addresses the close interactions and feedback controls between cyber components and physical components. The book first discusses some fundamental big data problems and solutions in large scale distributed CPSs. The book then addresses the design and control challenges in multiple CPS domains such as vehicular system, smart city, smart building, and digital microfluidic biochips. This book also presents the recent advances and trends in the maritime simulation system and the flood defence system. …mehr

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Produktbeschreibung
This book highlights research and survey articles dedicated to big data techniques for cyber-physical system (CPS), which addresses the close interactions and feedback controls between cyber components and physical components. The book first discusses some fundamental big data problems and solutions in large scale distributed CPSs. The book then addresses the design and control challenges in multiple CPS domains such as vehicular system, smart city, smart building, and digital microfluidic biochips. This book also presents the recent advances and trends in the maritime simulation system and the flood defence system.
Autorenporträt
Shiyan Hu   Professor Shiyan Hu received his Ph.D. in Computer Engineering from Texas A&M University in 2008. He is the Professor and Chair in Cyber-Physical System Security at University of Southampton. His research interests include Cyber-Physical Systems and Cyber-Physical System Security, where he has published more than 100 refereed papers, including 50+ in premier IEEE Transactions.   Prof. Hu is an ACM Distinguished Speaker, an IEEE Systems Council Distinguished Lecturer, a recipient of the 2017 IEEE Computer Society TCSC Middle Career Researcher Award, and a recipient of the 2014 U.S. National Science Foundation (NSF) CAREER Award. His publications have received a few distinctions such as the 2018 IEEE Systems Journal Best Paper Award, the 2017 Keynote Paper in IEEE Transactions on Computer-Aided Design, the Front Cover Paper in IEEE Transactions on Nanobioscience in March 2014, etc. His research has been featured in various public media such as National Science Foundation News Headlines, Science Daily, CBS, IEEE Spectrum, and Communications of ACM.   Prof. Hu is the Chair for IEEE Technical Committee on Cyber-Physical Systems. He is the Editor-In-Chief of IET Cyber-Physical Systems: Theory & Applications. He is the 2020 Editor-in-Chief Search Committee Chair for ACM Transactions on Design Automation for Electronic Systems. He is an Associate Editor for IEEE Transactions on Computer-Aided Design, IEEE Transactions on Industrial Informatics, IEEE Transactions on Circuits and Systems, ACM Transactions on Design Automation for Electronic Systems, and ACM Transactions on Cyber-Physical Systems. He is also a Guest Editor for eight IEEE/ACM journals such as Proceedings of the IEEE and IEEE Transactions on Computers. He has held chair positions in many major conferences. He is a Fellow of IET and a Fellow of British Computer Society. Bei Yu   Bei Yu is currentlyan Assistant Professor at the Department of Computer Science and Engineering, The Chinese University of Hong Kong. He received the Ph.D degree from Electrical and Computer Engineering, University of Texas at Austin, USA in 2014, and the M.S. degree in Computer Science from Tsinghua University, China in 2010. His current research interests include machine learning and combinatorial algorithm with applications in VLSI computer aided design (CAD) and computer vision. He has served as TPC Chair of 1st ACM/IEEE Workshop on Machine Learning for CAD (MLCAD), served in the program committees of DAC, ICCAD, DATE, ASPDAC, ISPD, the editorial boards of Integration, the VLSI Journal, and IET Cyber-Physical Systems: Theory & Applications. He is Editor of IEEE TCCPS Newsletter.   Prof. Yu received six Best Paper Awards from International Conference on Tools with Artificial Intelligence (ICTAI) 2019, Integration, the VLSI Journal in 2018, International Symposium on Physical Design (ISPD) 2017, SPIE Advanced Lithography Conference 2016, International Conference on Computer-Aided Design (ICCAD) 2013, Asia and South Pacific Design Automation Conference (ASPDAC) 2012, four other Best Paper Award Nominations (ASPDAC 2019, DAC 2014, ASPDAC 2013, and ICCAD 2011), five ICCAD/ISPD contest awards, IBM Ph.D. Scholarship in 2012, SPIE Education Scholarship in 2013, and EDAA Outstanding Dissertation Award in 2014.