CFD Analysis of Processor Heat Sink - Dabhole, Akshaykumar
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Every computer consists a processor and every processor release heat due to impedance offered by electronic circuits to electric current. Increased processing power causes increased heat dissipation, making processor temperature rise. This causes reduced processing speed, shortened life, malfunction or in some cases failure and thermal shutdown of processor. In this book, forced air cooling system mounted on processor was investigated. Effect of various air inlet locations and air velocity on processor temperature were numerically analysed by commercially available computational fluid dynamics…mehr

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Produktbeschreibung
Every computer consists a processor and every processor release heat due to impedance offered by electronic circuits to electric current. Increased processing power causes increased heat dissipation, making processor temperature rise. This causes reduced processing speed, shortened life, malfunction or in some cases failure and thermal shutdown of processor. In this book, forced air cooling system mounted on processor was investigated. Effect of various air inlet locations and air velocity on processor temperature were numerically analysed by commercially available computational fluid dynamics software. The results shows that modifications in conventions air cooling system can lower temperature and hot-spot on the heat sink.
Autorenporträt
An engineering professor with interest in Mechatronics, Machine Learning and CFD.