51,99 €
inkl. MwSt.
Versandkostenfrei*
Versandfertig in 6-10 Tagen
  • Broschiertes Buch

This book presents a systematic approach to the characterization, analysis, design, and optimization of orthotropic polymer composite fins used in heat sinks for electronic cooling applications. Morphological characterization and thermal conductivity measurements of thermally conductive Poly-Phenylene Sulphide composites are used to determine the significant directional thermal conductivity in such composites. An axisymmetric orthotropic thermal conductivity pin fin equation is derived to study the orthotropic thermal conductivity effects on pin fin heat transfer rate and temperature…mehr

Produktbeschreibung
This book presents a systematic approach to the
characterization, analysis, design, and optimization
of orthotropic polymer composite fins used in heat
sinks for electronic cooling applications.
Morphological characterization and thermal
conductivity measurements of thermally conductive
Poly-Phenylene Sulphide composites are used to
determine the significant directional thermal
conductivity in such composites. An axisymmetric
orthotropic thermal conductivity pin fin equation is
derived to study the orthotropic thermal
conductivity effects on pin fin heat transfer rate
and temperature distribution. FEM simulation and
water cooled experiments, focusing on the radial
temperature variations in single pin fins, are used
to validate the analytical model. Theoretical
models, CFD modeling, and experiments are used to
characterize the thermal performance of heat sinks,
fabricated of PPS composite pin fins, in air natural
convection and forced convection modes. Simplified
solutions, for the orthotropic fin heat transfer
rate that are easy to use and can be easily
implemented in a heat sink design and optimization
scheme, are presented.
Autorenporträt
Dr. Raj Bahadur is currently working as R&D Engineer at Intel
Corporation, USA. He is involved in research and development of
Intel CPU and communication systems. He has broad
exposure in assembly process, and package design of electronic
systems. He has authored and reviewed papers in several
International journals and Conferences.