Chemical-Mechanical Planarization of Semiconductor Materials

Herausgegeben:Oliver, M.R.

• Broschiertes Buch

Produktbeschreibung

Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor processing step, it was developed at IBM in the mid 1980s. From this beginning the technology has been widely adopted throughout the semiconductor industry. As basic CMP technology has been understood and accepted throughout the semiconductor industry, its uses in different parts of the semiconductor process have multiplied. This includes special steps for some special process ing flows, such as for DRAM technology. In addition, the availability of CMP technology has enabled the implementation of new technologies, with the best example being copper interconnect technology. Copper could not be practi cally implemented into semiconductor process flows until the advent of CMP. Unfortunately, the rapid acceptance and implementation of CMP technol ogy in wafer fabrication has occurred without a corresponding rate of advance in the underlying science. Progress is being made in understanding the un derlying CMP mechanisms, but, in general, it is slow and uneven. The most noteworthy exception to this trend is the science of metal CMP reactions, where the scientific understanding is actually driving much of the advance of the technology. There has been no corresponding progress in other CMP areas however.

Produktdetails

• Springer Series in Materials Science 69
• Verlag: Springer / Springer Berlin Heidelberg / Springer, Berlin
• Artikelnr. des Verlages: 978-3-642-07738-8
• Softcover reprint of hardcover 1st ed. 2004
• Seitenzahl: 444
• Erscheinungstermin: 1. Dezember 2010
• Englisch
• Abmessung: 235mm x 155mm x 24mm
• Gewicht: 669g
• ISBN-13: 9783642077388
• ISBN-10: 3642077382
• Artikelnr.: 32079186

Autorenporträt

Chemical Mechanical Planarization (CMP) is fast becoming the established technology for removing unwanted materials after etching from the semiconductor chip surface, as well as for other steps in the manufacturing process. This volume is a comprehensive review of CMP technology in state-of-the-art semiconductor manufacturing. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered, as are polishing tools and consumables. The leading edge issues of damascene and new dielectrics as well as slurryless technology are also developed.

Inhaltsangabe

1 Introduction.- 2 CMP Technology.- 3 Metal Polishing Processes.- 4 Metal CMP Science.- 5 Equipment Used in CMP Processes.- 6 CMP Polishing Pads.- 7 Fundamentals of CMP Slurry.- 8 CMP Cleaning.- 9 Patterned Wafer Effects.- 10 Integration Issues of CMP.- Appendix: Pourbaix Diagrams.- References.