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The aggressive scaling of CMOS integrated circuits
makes the design of power distribution networks a
serious challenge. This is because the supply
current and clock frequency are increasing, which
increases the power supply noise. Excessive power
supply noise can lead to severe degradation of chip
performance and even logic failure. Therefore, power
supply noise modeling and power integrity validation
are of great significance in GSI systems and 3-D
systems. Compact physical models enable quick
recognition of the power supply noise without doing
dedicated simulations. In this book, accurate and
compact physical models for the power supply noise
are derived for power hungry blocks, hot spots, 3-D
chip stacks, and chip/package co-design. The impacts
of noise on transmission line performance are also
investigated using compact physical modeling
schemes. The models can help designers gain
sufficient physical insights into the complicated
power delivery system and tradeoff various important
chip and package design parameters during the early
stages of design. The models are compared with
commercial tools and display high accuracy.
makes the design of power distribution networks a
serious challenge. This is because the supply
current and clock frequency are increasing, which
increases the power supply noise. Excessive power
supply noise can lead to severe degradation of chip
performance and even logic failure. Therefore, power
supply noise modeling and power integrity validation
are of great significance in GSI systems and 3-D
systems. Compact physical models enable quick
recognition of the power supply noise without doing
dedicated simulations. In this book, accurate and
compact physical models for the power supply noise
are derived for power hungry blocks, hot spots, 3-D
chip stacks, and chip/package co-design. The impacts
of noise on transmission line performance are also
investigated using compact physical modeling
schemes. The models can help designers gain
sufficient physical insights into the complicated
power delivery system and tradeoff various important
chip and package design parameters during the early
stages of design. The models are compared with
commercial tools and display high accuracy.