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This book is the ideal resource for EMI/EMC
researchers and engineers concerned about
modeling high frequency
EMI on cable bundles and
electronics. Many traditional EMI/EMC techniques
rely on quasi-static assumption and therefore, are
limited to only low frequencies. However, with
increased CPU clock speed and the proliferation of
high frequency wireless communication systems, it is
critical to account for non-static interactions at
high frequencies. This book bridges the gap between
traditional EMI/EMC tools and the need for advanced
computational techniques to characterize high
frequency electromagnetic interactions between cable
bundles and electronics in the presence of complex
structures such as automobiles or airplanes. This
book provides fresh, experimentally and
theoretically verified new techniques based on an
integration of full-wave electromagnetic analysis
with circuit domain tools such as HSPICE and ADS.
Its content is also enriched by several
applications, including high frequency EMI on
digital and RF circuits in the presence of complex
structures such as missile-like enclosures and
automobiles.
researchers and engineers concerned about
modeling high frequency
EMI on cable bundles and
electronics. Many traditional EMI/EMC techniques
rely on quasi-static assumption and therefore, are
limited to only low frequencies. However, with
increased CPU clock speed and the proliferation of
high frequency wireless communication systems, it is
critical to account for non-static interactions at
high frequencies. This book bridges the gap between
traditional EMI/EMC tools and the need for advanced
computational techniques to characterize high
frequency electromagnetic interactions between cable
bundles and electronics in the presence of complex
structures such as automobiles or airplanes. This
book provides fresh, experimentally and
theoretically verified new techniques based on an
integration of full-wave electromagnetic analysis
with circuit domain tools such as HSPICE and ADS.
Its content is also enriched by several
applications, including high frequency EMI on
digital and RF circuits in the presence of complex
structures such as missile-like enclosures and
automobiles.