The era of Sustainable and Energy Efficient Nanoelectronics and Nanosystems has come. The research and development on Scalable and 3D integrated Diversified functions together with new computing architectures is in full swing.
The era of Sustainable and Energy Efficient Nanoelectronics and Nanosystems has come. The research and development on Scalable and 3D integrated Diversified functions together with new computing architectures is in full swing.Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Simon Deleonibus was chief scientist with CEA-Leti, a technology research unit of French Alternative Energies and Atomic Energy Commission, where his research focused on architectures of micro- and nanoelectronic devices. He retired January 2016. Before joining CEA-Leti in 1986, he was with Thomson Semiconductors (1981-1986), where he developed advanced microelectronic devices and products. He is a visiting professor at the Tokyo Institute of Technology, Japan, since 2014; National Chiao Tung University, Taiwan, since 2015; and Chinese Academy of Sciences, China, since 2016. He is a distinguished CEA research director (2002), IEEE distinguished lecturer (2004), fellow of the IEEE (2006), and fellow of the Electrochemical Society (2015). Dr. Deleonibus is a recipient of the titles Chevalier de l'Ordre National du Mérite (2004), Chevalier de l'Ordre des Palmes Académiques (2011), and Grand Prix de l'Académie des Technologies (2005).
Inhaltsangabe
Part 1: From Nanoelectronics to Diversified Nanosystems 1. The Era of Sustainable and Energy Efficient Nanoelectronics and Nanosystems 2. From 2D to 3D Nonvolatile Memories 3. Three-dimensional (3D) Vertical RRAM 4. SOI Technologies for RF and Millimeter Wave Applications Part 2: Nanofunctions for Augmented Nanosystems 5. Graphene nanoelectromechanical (NEM) switch: ultimate downscaled NEM actuators to single molecule and zeptogram mass sensors 6. Self-powered 3D Nanosensor Systems for Mechanical Interfacing Applications 7.Miniaturization and packaging of implantable biomedical silicon devices
Part 1: From Nanoelectronics to Diversified Nanosystems 1. The Era of Sustainable and Energy Efficient Nanoelectronics and Nanosystems 2. From 2D to 3D Nonvolatile Memories 3. Three-dimensional (3D) Vertical RRAM 4. SOI Technologies for RF and Millimeter Wave Applications Part 2: Nanofunctions for Augmented Nanosystems 5. Graphene nanoelectromechanical (NEM) switch: ultimate downscaled NEM actuators to single molecule and zeptogram mass sensors 6. Self-powered 3D Nanosensor Systems for Mechanical Interfacing Applications 7.Miniaturization and packaging of implantable biomedical silicon devices
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