Design and Analysis of Millimeter-Wave Packaged Grid Array Antennas - Zhang, Bing
27,99 €
inkl. MwSt.
Versandkostenfrei*
Versandfertig in 6-10 Tagen
  • Broschiertes Buch

The increasing demand for high bit rate wireless communication prompts people resorting to the mmWave spectrum. A single chip radio becomes possible for the small wavelength of millimeter EM waves. The antenna plays an important role in a radio because its independent properties can affect the radio as a whole. Nowadays, mmWave antenna designs are shifting from the design of a conventional discrete device to antenna-on-chip (AoC) and antenna-in-package (AiP). The AiP is an independently designed device from the integrated circuit (IC), which leads to a wide selection of antenna prototypes.…mehr

Andere Kunden interessierten sich auch für
Produktbeschreibung
The increasing demand for high bit rate wireless communication prompts people resorting to the mmWave spectrum. A single chip radio becomes possible for the small wavelength of millimeter EM waves. The antenna plays an important role in a radio because its independent properties can affect the radio as a whole. Nowadays, mmWave antenna designs are shifting from the design of a conventional discrete device to antenna-on-chip (AoC) and antenna-in-package (AiP). The AiP is an independently designed device from the integrated circuit (IC), which leads to a wide selection of antenna prototypes. Various antennas can be utilized as mmWave AiPs, among which the grid array antenna (GAA) is a capable candidate. The book is devoted to provide a physical insight into the characteristics of mmWave GAAs, develop a synthesis method for mmWave GAA design, and provide solutions for mmWave AiP applications using GAA as the antenna prototype.
Autorenporträt
Bing Zhang received his Ph.D. from Nanyang Technological University, Singapore in 2013. He is now with the Microwave Electronics Laboratory, Chalmers University of Technology, Gothenburg Sweden. His research inerests include design of mmWave and THz antennas, co-design of RF passive and active devices, and packaging of mmWave devices.