Durability of Concrete/Epoxy Bonded System - Lau, Denvid
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Advanced composite materials become popular in construction industry for strengthening and retrofitting of existing structures. In such application, the interface between different materials is a critical region to be considered since the structural integrity relies much on the bond. Among various bonded material systems, the concrete/epoxy bonded system can be found easily in civil engineering applications such as FRP strengthening and retrofitting of concrete structures. Thus, knowledge on durability of concrete/epoxy bonded system is essential. Premature failures at the interface of the…mehr

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Produktbeschreibung
Advanced composite materials become popular in construction industry for strengthening and retrofitting of existing structures. In such application, the interface between different materials is a critical region to be considered since the structural integrity relies much on the bond. Among various bonded material systems, the concrete/epoxy bonded system can be found easily in civil engineering applications such as FRP strengthening and retrofitting of concrete structures. Thus, knowledge on durability of concrete/epoxy bonded system is essential. Premature failures at the interface of the bonded system may occur regardless of the durability of the individual constituent materials forming the material system. This book, therefore, provides a robust method in characterizing the mechanical properties in concrete/epoxy bonded system with the consideration of various degrees of moisture ingress and temperature levels. The experimental result and analysis presented in this book are valuable references for structural engineers and researchers in academia and industry.
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Autorenporträt
Mr. Denvid Lau is currently a Ph.D. Candidate in the Department of Civil and Environmental Engineering at Massachusetts Institute of Technology, Cambridge, Massachusetts, U.S.A. His current research areas include the durability of FRP-bonded concrete system and the atomistic modeling of silica/epoxy interface.