Learn how envelope tracking, polar modulation, and hybrid designs using these techniques, really work.Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Earl McCune is a practising engineer and Silicon Valley entrepreneur. A graduate of the University of California, Berkeley, Stanford University, and the University of California, Davis, he has over thirty-five years of postgraduate industry experience in wireless communications circuits and systems and more than sixty-five issued US patents. Now semi-retired, he has founded two successful start-up companies in addition to working in medium and very large sized corporations. He is also the author of Practical Digital Wireless Signals (Cambridge University Press, 2010).
Inhaltsangabe
Part I. Motivations, Definitions, and Principles: 1. Motivations 2. Definitions 3. Dynamic power supply common principles 4. Linear power amplifiers 5. Envelope tracking principles 6. Polar transmitter principles Part II. DPST Circuit Issues: 7. Linear PA circuit considerations for ET 8. Intentional circuit compression 9. Dynamic power supplies (TX is power sig proc, not NRG based) 10. Device technologies: special issues for DPS use 11. Hybrid system combinations 12. Multistage modulation Part III. Testing and Manufacturability: 13. Testing and calibration techniques Appendix A. Switching transistor evaluation metrics across technologies.
Part I. Motivations, Definitions, and Principles: 1. Motivations 2. Definitions 3. Dynamic power supply common principles 4. Linear power amplifiers 5. Envelope tracking principles 6. Polar transmitter principles Part II. DPST Circuit Issues: 7. Linear PA circuit considerations for ET 8. Intentional circuit compression 9. Dynamic power supplies (TX is power sig proc, not NRG based) 10. Device technologies: special issues for DPS use 11. Hybrid system combinations 12. Multistage modulation Part III. Testing and Manufacturability: 13. Testing and calibration techniques Appendix A. Switching transistor evaluation metrics across technologies.
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