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This work is devoted to investigate the tensile properties of the newly developed Sn 9Zn xBi (1, and 4 wt.%) lead free solder alloys at different strain rates and temperatures to compare the results with the eutectic Sn 9Zn. also, the investigation of creep characteristics at different stresses and temperatures for selected lead-free solder alloys are presented. The microstructure and the thermal properties of these alloys were also thoroughly investigated and further, to determine the effect of Bi addition on promoting the properties of Sn Zn alloys.