Rajesh Gomatam, Kash L. Mittal

Electrically Conductive Adhesives

• Gebundenes Buch

Produktbeschreibung

With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectronic packaging applications. ECAs are used in electronics for laptop computers, camcorders, watch electronics, hard-drive suspensions and a myriad of electronic equipments. Environmentally-friendly ECAs offer many advantages vis-A -vis solder, such as simple and low-temperature processing conditions, better thermo mechanical performance and finer pitch. This book is based on the two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to this topic. The book contains a total of 21 papers (reflecting overviews and original research) and is divided into three parts as follows: Part 1: Introduction and Recent Developments, Part 2: Mechanical, Durability and Reliability Aspects and Part 3: Characterization and Properties.

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Produktdetails

• Verlag: Brill
• Seitenzahl: 426
• Erscheinungstermin: 23. Dezember 2008
• Englisch
• Abmessung: 246mm x 163mm x 23mm
• Gewicht: 920g
• ISBN-13: 9789004165922
• ISBN-10: 9004165924
• Artikelnr.: 25921246

Autorenporträt

Gomatam\, Rajesh; Mittal\, Kash L.

Inhaltsangabe

Preface, Part 1: Introduction and Recent Developments Using Electrically
Conductive Inks and Adhesives as a Means to Satisfy European PCB
Manufacturing Directives, Part 2: Mechanical Durability and Reliability
Aspects Reliability of Anisotropic Conductive Adhesive Joints in Electronic
Packaging Applications Y. C. Lin and X. Chen Drop Test Performance of
Isotropic Electrically Conductive Adhesives, Part 3: Characterization and
Properties Novel Techniques for Characterization of Fast-Cure Anisotropic
Conductive and Non-conductive Adhesives M. Teo Chemorheology of
Epoxy/Nickel Conductive Adhesives During Processing and Cure