Electronic Packaging for High Reliability, Low Cost Electronics

Herausgegeben:Tummala, R. R.; Kosec, Marija; Jones, W. K.; Belavic, Darko

• Broschiertes Buch

Produktbeschreibung

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

Produktdetails

• Nato Science Partnership Subseries: 3 57
• Verlag: Springer / Springer Netherlands
• Artikelnr. des Verlages: 978-90-481-5085-4
• Softcover reprint of hardcover 1st ed. 1998
• Seitenzahl: 308
• Erscheinungstermin: 3. Dezember 2010
• Englisch
• Abmessung: 235mm x 155mm x 17mm
• Gewicht: 470g
• ISBN-13: 9789048150854
• ISBN-10: 904815085X
• Artikelnr.: 32104979

Inhaltsangabe

Preface. Performance Predictions. Possibilities of Thermal Resonance in
Microcircuits; G. De Mey. Signal Integrity Analysis in Cost Sensitive
Interconnections; P. Svasta, et al. The Use of Nonlinearity Measurements
for the Reliability Assessment; P.J. Mach. Effect of Plastic Package
Geometry on its Propensity to Moisture Induced Failure; E. Suhir. The
Impact of Stress on the Noise, Quality and Reliability of Passive and
Active Devices; J. Sikula, P. Vasina. Process and Materials Development.
Smart Unit for Technological Monitoring in Electrochemical Industry; R.
Ionescu, et al. Lower Patterning of Printed Wiring Boards for MCM-Ls; ZS.
Illyefalvi-Vitéz, et al. Silver Filled Adhesives-Controlling Rheology and
Electrical Conductivity; P. Sexton, et al. Silicides Formation in
Metal-Silicon Film Systems: The Role of Impurities; Yu. Makogon, S.I.
Sidorenko. Mechanical properties of Pb-Sn-In-Ag Solders from -100°C to
150°C; W.K. Jones, et al. MCM-D/L. The Need for Low Cost, High Density
Packaging and Interconnect Technology; P. Garrou. Application of
Electroconducting Polymers in Low Cost Devices; G. Harsanyi, et al.
Photosensitive Polymer Thick Films; S. Achmatowicz, et al. Characteristics
of Passive Ta-Resistive Planes Embedded in Al-Sheet `PCB'-Compatible for
Integrated MCM-Substrates or Packaging Carriers; P. Philippov. MCM-C. Use
of Gravure Offset Printing in Manufacturing of Electronic Applications;
S.J. Leppävuori, A.K. Uusimäki. Investigation of Thick Film Resistors for a
Multilayer System; M. Hrovat, et al. Reliability Aspects of the Batch
Production Based on PTF Technology; M. Somora, et al. A Five Layer Thin
Film MCM-Si Design Using Oxynitride Dielectrics; J. Lernout, et al.
Packaging Applications. An ASIC View of Low Cost Packaging; P.R. Van Loan.
Packaging Technologies for Thick Film Sensors; D. Belavič, et al.
Radiation Hardened ASIC Design for Space Applications; J. Trontelj, L.
Trontelj. Low Cost Packaging Encoder Circuits; S. Amon, et al. Microwave
Filters Manufactured by Advanced Thick-Film Techniques and Novel Silver
Pastes; M. Cież, et al. Systems Level Packaging. System Reliability;
N. Sinnadurai. Capabilities and Limitations in Microelectronic Packaging
and Assembly within the FSU; S. Muckett. MCM-L in IBM Technology Overview;
G. Vendramin. Applications of the Interconnected Mesh Power System (IMPS)
Substrate Layer Reduction Topology; L.W. Schaper. Flip Chip and BGA
Assembly. Plastic Ball Grid Array (PBGA): A Rising Package Solution; K.
Kurzweil, et al. Low Cost Flip Chip on Glass Epoxy FR4 Substrates for
Personal Electronics; N. Van Veen. Chip Stacking using Flip Chip
Technologies; M. Amskov. Flip Chip Joining Technology Applications; J.
Vähäkangas, et al. Novel Underfills: Effect of the Filler for Fast-Flow
Underfills and Latent Catalyst for No-Flow Underfills on the Processing of
Flip Chip Devices; C.P. Wong, et al. Author Index. Keyword Index.