Erdogan Madenci, Ibrahim Guven, Bahattin Kilic

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

• Broschiertes Buch

Produktbeschreibung

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis.

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

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Produktdetails

• The Springer International Series in Engineering and Computer Science .719
• Verlag: Springer / Springer US / Springer, Berlin
• Artikelnr. des Verlages: 978-1-4613-4989-1
• Softcover reprint of the original 1st ed. 2003
• Seitenzahl: 208
• Erscheinungstermin: 14. Oktober 2012
• Englisch
• Abmessung: 235mm x 155mm x 12mm
• Gewicht: 320g
• ISBN-13: 9781461349891
• ISBN-10: 1461349893
• Artikelnr.: 37477799

Inhaltsangabe

1 Introduction.- 1.1 Numerical Modeling with Finite Element Analysis.- 1.2 Constitutive Relations.- 1.3 Failure Prediction.- 1.4 References.- 2 Thermomechanical Fatigue Life Prediction Analysis.- 2.1 Approach.- 2.2 Analysis Steps.- 2.3 Case Study: BGA-Type Package.- 2.4 References.- 3 Mechanical Bending Fatigue Life Prediction Analysis.- 3.1 Approach.- 3.2 Analysis Steps.- 3.3 Case Study: BGA-Type Package.- 3.4 References.- 4 Macro Reference Library.- 4.1 Overview.- 4.2 Preprocessor.- 4.3 Solution.- 4.4 Postprocessing.- 4.5 Reference.- Appendix A: Installation and Execution.- A.1 Steps for ReliANS Installation on a PC Platform.- A.2 Steps for Adding Working Directories for Use in ReliANS.- A.3 Demonstration of ReliANS Installation and Adding New Directories.- A.4 Installation of ReliANS on UNIX Systems.- Appendix B: Input Listings for Case Studies.- B. 1 Input Listing for the Case Study Given in Chapter 2.- B.2 Input Listing for the Case Study Given in Chapter 3.

Rezensionen

From the reviews: "Fatigue Life Prediction of Solder Joints in Electronic Packages ... excites the interest of engineers and allows them to conduct fatigue reliability analysis of solder joints. ... there must by now be this book on the bookshelf of every one concerned with fatigue reliability analyses of solder joints which is an important issue in the electronics industry." (Current Engineering Practice, Vol. 47, 2002-2003)