The book treats the problem of single- and two-phase heat transfer in micro-channels. We consider the effect of wall roughness on energy dissipation, axial heat conduction, operating parameters corresponding to stable and unstable flow and steady and unsteady flow with distinct interface. In the book we use our own results on a number of problems related to flow and heat transfer, as well as those of numerous theoretical and experimental investigations published in current literature. The presented materials are easily comprehensible to engineers and engineering students with some graduate-level familiarity of fluid mechanics and the theory of heat transfer.
The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transferin systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.
The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transferin systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.
From the reviews:
"This monograph discuss many aspects of flow and heat transfer in single channels and networks of channels. ... this book is a valuable contribution to the literature on heat transfer and single and two-phase flow in small channels. The book is nicely put together and largely free of typographical errors. ... All readers will gain something from spending time with this book. In addition, the authors have succeeded in producing a monograph that should motivate new research in the field." (Howard A. Stone, International Journal of Multiphase Flow, Vol. 35 (6), 2009)
"The topic of micro-channels finds a very large range of applications, particularly in the context of cooling of electronic equipment, and this book is of particular importance to the field. ... The book fills a gap in the existing literature and covers a large body of new knowledge in the thermo-fluid dynamics and applications in micro-geometries. ... Intended for both academic and industrial audiences ... . The book is recommended for libraries, R & D establishments as well as for educational institutions." (K. N. Shukla, Zentralblatt MATH, Vol. 1156, 2009)
"This monograph discuss many aspects of flow and heat transfer in single channels and networks of channels. ... this book is a valuable contribution to the literature on heat transfer and single and two-phase flow in small channels. The book is nicely put together and largely free of typographical errors. ... All readers will gain something from spending time with this book. In addition, the authors have succeeded in producing a monograph that should motivate new research in the field." (Howard A. Stone, International Journal of Multiphase Flow, Vol. 35 (6), 2009)
"The topic of micro-channels finds a very large range of applications, particularly in the context of cooling of electronic equipment, and this book is of particular importance to the field. ... The book fills a gap in the existing literature and covers a large body of new knowledge in the thermo-fluid dynamics and applications in micro-geometries. ... Intended for both academic and industrial audiences ... . The book is recommended for libraries, R & D establishments as well as for educational institutions." (K. N. Shukla, Zentralblatt MATH, Vol. 1156, 2009)