Dong Sun Lee (Kyungnam University, Masan, South Korea), Kit L. Yam (Rutgers University, New Brunswick, New Jersey, USA), Luciano Piergiovanni (Italy University of Milan)

Food Packaging Science and Technology

• Gebundenes Buch

Produktbeschreibung

Offers coverage of packaging materials and their properties, industry operations, emerging technologies, active and intelligent packaging. This book features developments in food package concepts and practices, as well as scientific and technical papers.

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Produktdetails

• Verlag: Taylor & Francis Inc
• Seitenzahl: 656
• Erscheinungstermin: 1. März 2008
• Englisch
• Abmessung: 238mm x 163mm x 35mm
• Gewicht: 1154g
• ISBN-13: 9780824727796
• ISBN-10: 0824727797
• Artikelnr.: 40538264

Autorenporträt

Dong Sun Lee, Kit L. Yam, Luciano Piergiovanni

Inhaltsangabe

Overview of Food Packaging Systems. Chemical Structures and Properties of
Packaging Materials. Physical Properties of Packaging Materials. Permeation
of Gas and Vapor. Migration and Flavor Scalping. Food Packaging Polymers.
Glass Packaging. Metal Packaging. Cellulosic Packaging. End-of-Line
Operations. Food Packaging Operations and Technology. Thermally Preserved
Food Packaging: Retortable and Aseptic. Vacuum/Modified Atmosphere
Packaging. Microwavable Packaging. Active and Intelligent Packaging. Shelf
Life of Packaged Food Products. Elements of Packaging, Distribution and
Shelf Life of Each Category Foods. Sustainable Food Packaging. Sociological
and Legislative Considerations.