Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability
Versandkostenfrei!
Versandfertig in 6-10 Tagen
Weitere Ausgaben:
PAYBACK Punkte
38 °P sammeln!
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Produktbeschreibung
- Verlag: Springer / Springer US / Springer, Berlin
- Artikelnr. des Verlages: 978-1-4899-7801-1
- Softcover reprint of the original 1st ed. 2015
- Seitenzahl: 268
- Erscheinungstermin: 1. Oktober 2016
- Englisch
- Abmessung: 235mm x 155mm x 14mm
- Gewicht: 460g
- ISBN-13: 9781489978011
- ISBN-10: 1489978011
- Artikelnr.: 45999877
Herstellerkennzeichnung
Springer-Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
ProductSafety@springernature.com
From the book reviews:
"The book gives wide perspectives on the technical insights of lead-free solder interconnect system and reliability prediction in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of lead-free solder interconnection, and can serve as a very informative technical reference. Valuable as a learning tool for fundamentals of lead-free solder interconnect technology, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners." (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, February, 2015)
"The book gives wide perspectives on the technical insights of lead-free solder interconnect system and reliability prediction in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of lead-free solder interconnection, and can serve as a very informative technical reference. Valuable as a learning tool for fundamentals of lead-free solder interconnect technology, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners." (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, February, 2015)
Für dieses Produkt wurde noch keine Bewertung abgegeben. Wir würden uns sehr freuen, wenn du die erste Bewertung schreibst!
Eine Bewertung schreiben
Eine Bewertung schreiben
Andere Kunden interessierten sich für