Rao Tummala

Fundamentals of Microsystems Packaging

Mitwirkender: Tummala, Rao R.

• Gebundenes Buch

Produktbeschreibung

This is aninterdisciplinary tutorial designed for electrical, mechanical, chemical, and materials engineers working in the electronic packaging fields. Each chapter covers a major packaging technology according to a master gird, so all chapters follow an identical format. Each chapter includes schematics and block diagrams, problems and solutions, and details the impact of each technology on electrical, materials, chemical, and mechanical tracks. Key Features: Star-studded author tream led by Tummala, the biggest name in the field Two color throughout Each technology detailed for electrical, mechanical, chemical, and materials aspects

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Produktdetails

• Verlag: McGraw-Hill Professional
• Seitenzahl: 967
• Erscheinungstermin: 29. Mai 2001
• Englisch
• Abmessung: 242mm x 193mm x 40mm
• Gewicht: 1630g
• ISBN-13: 9780071371698
• ISBN-10: 0071371699
• Artikelnr.: 09697473

Autorenporträt

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.

Inhaltsangabe

Chapter 1: Introduction to Microsystems Packaging. Chapter 2: The Role of Packaging in Microelectronics Chapter 3: The Role of Packaging in Microsystems. Chapter 4: Fundamentals of Electrical Package Design. Chapter 5: Fundamentals of Design for Reliability. Chapter 6: Fundamentals of Thermal Management. Chapter 7: Fundamentals of Single Chip Packaging. Chapter 8: Funamentals of Multichip Packaging. Chapter 9: Fundamentals of IC Assembly. Chapter 10: Fundamentals of Water-Level Packaging. Chapter 11: Fundamentals of Passives: Discrete, Integrated, and Embedded. Chapter 12: Fundamentals of Optoelectronics. Chapter 13: Fundamentals of RF Packaging. Chapter 14: Fundamentals of Microelectromechanical Systems. Chapter 15: Fundamentals of Sealing and Encapsulation. Chapter 16: Fundamentals of System-Level PWB Technologies. Chapter 17: Fundamentals of Board Assembly. Chapter 18: Fundamentals of Packaging Materials and Processes. Chapter 19: Fundamentals of Electrical Testing. Chapter 20: Fundamentals of Package Manufacturing. Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.