Michael Pecht, Riko Radojcic, Gopal Rao

Guidebook for Managing Silicon Chip Reliability

• Broschiertes Buch

Produktbeschreibung

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

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Produktdetails

• Verlag: CRC Press
• Seitenzahl: 226
• Erscheinungstermin: 7. Oktober 2019
• Englisch
• Abmessung: 234mm x 156mm x 12mm
• Gewicht: 351g
• ISBN-13: 9780367400064
• ISBN-10: 0367400065
• Artikelnr.: 58053000

Autorenporträt

Pecht, Michael; Radojcic, Riko; Rao, Gopal

Inhaltsangabe

Introduction How Devices Fail Intrinsic Mechanisms Extrinsic Mechanisms
Intrinsic Device Sensitivities Device Transconductance Sensitivities
Leakage Current Sensitivities Breakdown Issues Electromigration Description
of the Mechanism Modeling of the Mechanism How to Detect/Test How to Manage
Hot Carrier Aging Description of the Mechanism Modeling of the Mechanism
Detection of Hot Carrier Aging Avoidance of Hot Carrier Aging Time
Dependent Dielectric Breakdown Description of the Mechanism Modeling of the
Mechanism How to Detect/Test How to Avoid and Manage Mechanical Stress
Induced Migration Description of the Mechanism Modeling of the Mechanism
How to Detect/Test How to Manage Alpha Particle Sensitivity Description of
the Mechanism Modeling of the Mechanism Prevention of Alpha Particle
Induced Damage Electrostatic Discharge and Electrical Overstress
Description of the Mechanism Modeling of the Mechanism Avoiding ESD/EOS
Failures Latch-Up Description of the Mechanism How to Detect How to Avoid
Qualification Qualification Testing Virtual Qualification Screening
Functional Tests Burn-In Tests Iddq Tests Design for Reliability Design
System Effective Management of Wear-Out Failures Extrinsic Reliability
Mechanisms Infant Mortality Failure Mechanisms Circuit Sensitivities
Summary