This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.
This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Seda Ogrenci-Memik is an Associate Professor at the Electrical Engineering and Computer Science Department of Northwestern University, Illinois, where her research interests include thermal-aware design and management of high performance systems, embedded and reconfigurable computing, and thermal sensing technologies. Dr Ogrenci-Memik has served as technical program chair, committee member, organizing committee member, and track chair of several conferences, including ICCAD, DAC, DATE, EUC, FPL, GLSVLSI, and ISVLSI and she has served on the Editorial Board of IEEE Transactions on VLSI.
Inhaltsangabe
Chapter 1: Heat in integrated circuits and systems Chapter 2: On-chip temperature sensing Chapter 3: Dynamic thermal management Chapter 4: Active cooling Chapter 5: Mitigating thermal events at the system level and above Chapter 6: Emerging directions in thermal-aware systems Appendix A: Relevant units and metrics
Chapter 1: Heat in integrated circuits and systems Chapter 2: On-chip temperature sensing Chapter 3: Dynamic thermal management Chapter 4: Active cooling Chapter 5: Mitigating thermal events at the system level and above Chapter 6: Emerging directions in thermal-aware systems Appendix A: Relevant units and metrics
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