Seda Ogrenci-Memik

Heat Management in Integrated Circuits: On-Chip and System-Level Monitoring and Cooling

• Gebundenes Buch

Produktbeschreibung

This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.

Produktdetails

• Materials, Circuits and Device
• Verlag: Institution of Engineering & Technology
• Seitenzahl: 264
• Erscheinungstermin: 1. Dezember 2015
• Englisch
• Abmessung: 239mm x 160mm x 20mm
• Gewicht: 590g
• ISBN-13: 9781849199346
• ISBN-10: 1849199345
• Artikelnr.: 42905966

Autorenporträt

Seda Ogrenci-Memik is an Associate Professor at the Electrical Engineering and Computer Science Department of Northwestern University, Illinois, where her research interests include thermal-aware design and management of high performance systems, embedded and reconfigurable computing, and thermal sensing technologies. Dr Ogrenci-Memik has served as technical program chair, committee member, organizing committee member, and track chair of several conferences, including ICCAD, DAC, DATE, EUC, FPL, GLSVLSI, and ISVLSI and she has served on the Editorial Board of IEEE Transactions on VLSI.

Inhaltsangabe

Chapter 1: Heat in integrated circuits and systems
Chapter 2: On-chip temperature sensing
Chapter 3: Dynamic thermal management
Chapter 4: Active cooling
Chapter 5: Mitigating thermal events at the system level and above
Chapter 6: Emerging directions in thermal-aware systems
Appendix A: Relevant units and metrics