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Rapid development in manufacturing technology increases the functionality & compactness of the components. The miniaturization of electronics results in higher rate of power dissipation per unit volume. Thus effective thermal management becomes ever more critical to maintain the operation temperature which would ensure the efficiency and reliability of the electronic components. The objective of the study is to examine the effects of the fin on the thermal performance. Various types of fin made up of different material are analyzed under constant heat flux condition. Cooling has been done under forced convection.