Chulwoo Kim, Hyun-Woo Lee, Junyoung Song

High-Bandwidth Memory Interface

• Broschiertes Buch

Produktbeschreibung

This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

Produktdetails

• SpringerBriefs in Electrical and Computer Engineering
• Verlag: Springer / Springer International Publishing / Springer, Berlin
• Artikelnr. des Verlages: 978-3-319-02380-9
• 2014
• Seitenzahl: 96
• Erscheinungstermin: 18. November 2013
• Englisch
• Abmessung: 235mm x 155mm x 6mm
• Gewicht: 168g
• ISBN-13: 9783319023809
• ISBN-10: 3319023802
• Artikelnr.: 39301962

Inhaltsangabe

An introduction to high-speed DRAM.- An I/O Line Configuration and Organization of DRAM.- Clock generation and distribution.- Transceiver Design.- TSV Interface for DRAM.