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In this study high-speed oxide-confined VCSELs were fabricated and characterized. Complete fabrication processes for top-emitting self- aligned and non-self-aligned 850nm and 980nm high-speed VCSELs were developed. A complete fabrication process for bottom-emitting, non-self-aligned, flip-chip bonded 980nm high-speed VCSELs was developed. Some of the critical fabrication steps that affect the VCSEL s speed were examined. The effect of a heat-sinking layer on the performance of high-speed VCSELs was demonstrated for 850nm and 980nm devices. To further improve the understanding of current high-…mehr

Produktbeschreibung
In this study high-speed oxide-confined VCSELs were
fabricated and characterized.
Complete fabrication processes for top-emitting self-
aligned and non-self-aligned 850nm
and 980nm high-speed VCSELs were developed. A
complete fabrication process for
bottom-emitting, non-self-aligned, flip-chip bonded
980nm high-speed VCSELs was
developed. Some of the critical fabrication steps
that affect the VCSEL s speed were
examined. The effect of a heat-sinking layer on the
performance of high-speed VCSELs
was demonstrated for 850nm and 980nm devices. To
further improve the understanding of current high-
speed VCSEL performance restrictions, the effect of
external heating on the VCSEL s resonance frequency
and damping factor was examined for top-emitting,
self-aligned 980nm VCSELs. Furthermore, as the
contacts of the self-aligned VCSELs go through
annealing, etching, and oxidation, experiments on
metal systems used were performed. To better model
the high-speed devices, the dielectric properties of
four different spin-on dielectrics were
investigated.
Autorenporträt
Dr. Ahmad N.AL-Omari: Finished his MSc and PhD in Electrical
Engineering from Colorado State University. A Semiconductor
Cleanroom manager and a postdoctoral fellow at Colorado State
University. Currently, an assistant professor at Yarmouk
University. He is a member of IEEE,HKN,JEA,SPIE,OSA,IET and a
reviewer for IEEE,OSA,and SPIE.