In-plane MEMS Thermoelectric Microcooler - Yao, Da-Jeng
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Dr. Yao is an associate professor at Institute of NanoEngineering and MicroSystems (NEMS), also an adjunct professor at Department of Power Mechanical Engineering and Department of Engineering System and Science, National Tsing Hua University, Taiwan. He was born at Taipei, Taiwan in 1969. He received his Ph.D. from department of Mechanical and Aerospace Engineering, University of California at Los Angeles (UCLA) in 2001. His dissertation was focused on the design and fabrication of in-plane MEMS thermoelectric microcooler (u-TEC), which can be used for cooling microchip locally or stabilizing…mehr

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Produktbeschreibung
Dr. Yao is an associate professor at Institute of NanoEngineering and MicroSystems (NEMS), also an adjunct professor at Department of Power Mechanical Engineering and Department of Engineering System and Science, National Tsing Hua University, Taiwan. He was born at Taipei, Taiwan in 1969. He received his Ph.D. from department of Mechanical and Aerospace Engineering, University of California at Los Angeles (UCLA) in 2001. His dissertation was focused on the design and fabrication of in-plane MEMS thermoelectric microcooler (u-TEC), which can be used for cooling microchip locally or stabilizing temperature for bio-medical applications. His research scope is to combine his strong backgrounds (MEMS and thermal fluidics) on micro science researches. From the application points of view, BioMEMS and MEMS packaging are his focused research topics. From the fundamental science points of view, thermo-fluidic MEMS and thin film property measurement are the selected research topics. To build the multidisciplinary research team for developing interdisciplinary technologies under his research scope is his goal at National Tsing Hua University.
Autorenporträt
Dr. Yao is an associate professor at Institute of NanoEngineering and MicroSystems(NEMS), National Tsing Hua University, Taiwan. He was born at Taipei, Taiwan in 1969. He received his Ph.D. from department of Mechanical and Aerospace Engineering, University of California at Los Angeles (UCLA) in 2001.