Reliability of super-systems of basic technical solutions in optical devices and instruments, obtained by increasing the efficiency and reliability of subsystems of electronic blocks obtained using encapsulated composite materials and technologies for the production of electronic printed circuit boards that apply the principles of hierarchy of construction inherent in technologies and their combinations.Ensuring the required level of performance of processor technology in control and control units using advanced methods for the production of thin-film microassembly boards, including the use of flexible automated production modules and high-speed methods of electroplating and electrochemical coatings that implement processes without the negative impact of the edge effect of electrodes and with electrochemical cells operating in a directed flow of electrolyte.