
Integrated Passive Component Technology
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This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.
_ Describes the processes available for creating integrated passives, measuring their properties, and applying them.
_ Brings reader up to date in a fast-moving technology.
_ Enables reader to implement the technology into a manufacturing environment.
_ Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.
_ Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.
_ Describes the processes available for creating integrated passives, measuring their properties, and applying them.
_ Brings reader up to date in a fast-moving technology.
_ Enables reader to implement the technology into a manufacturing environment.
_ Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.
_ Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.
RICHARD K. ULRICH, PhD, is a professor of Chemical Engineering at the University of Arkansas at Fayetteville. He is a NEMI committee member, a Visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society's Dielectric Science and Technology Division. LEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives.
Produktbeschreibung
- Verlag: Wiley & Sons
- 1. Auflage
- Seitenzahl: 400
- Erscheinungstermin: 30. Juni 2003
- Englisch
- Abmessung: 240mm x 161mm x 26mm
- Gewicht: 685g
- ISBN-13: 9780471244318
- ISBN-10: 0471244317
- Artikelnr.: 11429397
Herstellerkennzeichnung
Libri GmbH
Europaallee 1
36244 Bad Hersfeld
gpsr@libri.de
"...an interesting and useful book; I wholeheartedly recommend it."(Circuit World, Vol.30, No. 2003)
"...a comprehensive look at the reasons and current challenges...[of integrating] passive devices into board or IC...just the right dose of the math to explain the physics and theory behind the technology." (IEEE Circuits & Devices Magazine, Jan/Feb 2005)
"...an interesting and useful book; I wholeheartedly recommend it."(Circuit World, Vol.30, No. 2003)
"...an interesting and useful book; I wholeheartedly recommend it."(Circuit World, Vol.30, No. 2003)
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