Francesc Moll, Miquel Roca

Interconnection Noise in VLSI Circuits

• Gebundenes Buch

Produktbeschreibung

This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is towards giving general information rather than a compilation of practical cases. Each chapter contains a list of references for the topics.

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Produktdetails

• Verlag: Springer Netherlands
• 2004 edition
• Seitenzahl: 195
• Erscheinungstermin: 31. Dezember 2003
• Englisch
• Abmessung: 255mm x 154mm x 14mm
• Gewicht: 533g
• ISBN-13: 9781402077333
• ISBN-10: 1402077335
• Artikelnr.: 14007202

Inhaltsangabe

-List of Figures. List of Tables.
-Preface. Acknowledgements.
-1: Microelectronic Interconnections. 1. Signal transmission on interconnects. 2. On-chip interconnections. 3. Package level interconnections.
-2: Interconnect Modeling. 1. Physical foundations for circuit models of interconnections. 2. Lossless transmission line model. 3. Loss transmission line model. 4. Optimum line model selection.
-3: Crosstalk Effects in Digital Circuits. 1. Spurious signals. 2. Crosstalk induced delay. 3. Energy dissipation due to crosstalk. 4. Crosstalk effects in logic VLSI circuits.
-4: Packaging Interconnects. 1. Packaging structure. 2. Lumped electrical parameter modeling of packages. 3. Circuit modeling from measurement. 4. Power distribution modeling from EM simulation. 5. Simulations of package effects.
-5: Techniques for Avoiding Interconnection Noise. 1. The noise detection problem. 2. Brief introduction to the testing of logic circuits. 3. Crosstalk-induced spurious signal detection. 4. Other test techniques.

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Microelectronic Interconnections.- Interconnect Modeling in Circuit Simulation.- Crosstalk Effects in Digital Circuits.- Packaging Interconnects.- Techniques for Avoiding Interconnection Noise.- Noise Detection and Testing in Logic Circuits.