IUTAM Symposium on Field Analyses for Determination of Material Parameters ¿ Experimental and Numerical Aspects

Proceedings of the IUTAM Symposium held in Abisko National Park, Kiruna, Sweden, July 31 ¿ August 4, 2000
Herausgegeben:Sundin, K. G.; Ståhle, P.

• Broschiertes Buch

Produktbeschreibung

The symposiumwas motivatedby theincreasing need for modelling of material behaviourundervarious mechan icalconditions. This need is driven by the evolut ion ofcomputer capac ityand the resulting ability for engineers and scien tiststo address complexproblems . Reliable models formaterialbehaviour, including accurate numericalvalues of parameters ,are necessary for a continued beneficial development ofthe computational side of solid mechanics .High rate plasticity ,thermally assisted creep and phasetransformationsare only a fewexamplesof areas where more accurate modelsare needed. Experiments are necessary for the establishment ofmodels and parameters , and modified versionsof conventional test methods can make important contributions . Also modern optical methodsoffer a highpotentialfor futureexperimental development. Numerical simulations ofexperiments and so-called inverse modelling arealso frequentlyused techniques. The aim of the symposium was to bring together researchers with an interest in the areaofexperimental and computational aspects ofmaterial modelling for exchange and discussionofpromising methodsandresults. Abisko,a national park in the Swedish mountain district about 200 km north of the arctic circle and about one hourve dri from the airport ofKiruna,was chosen for the symposium. The tourist hotel in the park , overlookinga beautiful lake , offered a suitablevenue for the symposium. This environment with tracks for short walks (and long hikes),goals for small excursions and a hotel with restaurant and bar ve the ga delegatesmany opportunitiesto meet , socialiseand discuss during breaks and evenings.

Produktdetails

• Solid Mechanics and Its Applications 109
• Verlag: Springer / Springer Netherlands
• Artikelnr. des Verlages: 978-94-010-3976-5
• Softcover reprint of the original 1st ed. 2003
• Seitenzahl: 260
• Erscheinungstermin: 29. Oktober 2012
• Englisch
• Abmessung: 240mm x 160mm x 15mm
• Gewicht: 421g
• ISBN-13: 9789401039765
• ISBN-10: 9401039763
• Artikelnr.: 37478806

Inhaltsangabe

Experimental Methods.- Whole-Field Displacement Measurement With Moiré Interferometry as a Basis for a Microstructural FE Model of a Polymer Bonded Explosive.- Measurement of Microscopic Residual Stress Based on the Evolution of Surface Roughness During Shallow Chemical Etching.- The Incubation Time Theory and Experiment.- Affordable TMF Testing Supported by FE Simulation.- Identification of Dynamic Properties of Railway Track.- Optical Method to Study Material Behaviour at High Strain Rates.- Determination of Cylindrical Elastic Orthotropy in Wood by Digital Speckle Photography.- Optimization Techniques and Simulation Methods.- Identification of Elastic/Visco-Plastic Material Constants Under Impact Loading.- Parameter Identification for Inverse Problems in Metal Forming Simulations.- One Step Prediction Error Approach to the Identification Problem of Creep and Viscoplastic Material Models.- Automated Identification and Calculation of the Parameters of Non-Linear Material Models.- Inversion Method Using Spectral Decomposition of Green'S Functions.- Determination of Ballast Parameters of Railway Track Using an Optimisation Technique.- Estimation of Material Parameters at Elevated Temperatures by Inverse Modelling of A Gleeble Experiment.- Material Modeling.- Hydride-Induced Embrittlement in Metals -Stress and Temperature Effects.- A Non-Isothermal Model for the Phase Transformations and the Mechanical Behaviour of a 12% Chromium Steel.- Size Effect on Stress-Intensity Factors of CNS Specimen With an Interface Crack Subjected To Mixed-Mode Loading.- On Pennyshaped Equilibrium Cracks in Materials Reinforced by Fibers.- Identification of Stress from Strain for Body With Not Fully Identified Constitutive Relations.- Evaluation Method of Interface Strength Between ThinFilms In LSI.- List of Authors.