Andere Kunden interessierten sich auch für
![2D Nanomaterials Processing and Integration in Miniaturized Devices]( "2D Nanomaterials Processing and Integration in Miniaturized Devices")
2D Nanomaterials Processing and Integration in Miniaturized Devices51,99 €![Advanced Technique and Future Perspective for Next Generation Optical Fiber Communications]( "Advanced Technique and Future Perspective for Next Generation Optical Fiber Communications")
Advanced Technique and Future Perspective for Next Generation Optical Fiber Communications60,99 €![Chemical Physics of Thin Film Deposition Processes for Micro- and Nano-Technologies]( "Chemical Physics of Thin Film Deposition Processes for Micro- and Nano-Technologies")
Chemical Physics of Thin Film Deposition Processes for Micro- and Nano-Technologies83,99 €![Le terme technique]( "Le terme technique")
Le terme technique89,99 €![Micro-Nano Surface Functionalization of Materials and Thin Films for Optical Applications]( "Micro-Nano Surface Functionalization of Materials and Thin Films for Optical Applications")
Micro-Nano Surface Functionalization of Materials and Thin Films for Optical Applications47,99 €![Scientific Principles and Technique of Optical Fabrication Processes]( "Scientific Principles and Technique of Optical Fabrication Processes")
Scientific Principles and Technique of Optical Fabrication Processes143,99 €![Electrospinning Technique and Its Application for Solar Cells, Batteries and Biotechnology]( "Electrospinning Technique and Its Application for Solar Cells, Batteries and Biotechnology")
Electrospinning Technique and Its Application for Solar Cells, Batteries and Biotechnology183,99 €
Laser-induced backside wet etching (LIBWE) is a promising technique for direct patterning of trans-parent materials with high quality. LIBWE causes laser etching at the back surface of the transparent sample that is in contact with an absorbing liquid. In this work, the etch process has been experimen-tally investigated to study the etch mechanism and ascertain the dominating processes at the backside etching of the transparent materials fused silica, glasses, quartz, MgF2, CaF2, and sapphire. The influ-ence of process parameters on etch rate and surface quality have been systematically studied. The main characteristics of the etching process are a small etching threshold (~0.33 J/cm²; fused silica), small etch rates (1 20 nm/pulse), small roughness of etched surfaces (less than 10 nm rms), an incuba-tion behavior, and a surface micro topography that depend on the etched material and the liquid. With this knowledge, the fabrication of well-defined and high quality features into fused silica by LIBWE is demonstrated, which is potentially applicable for the shaping of microoptical components.