Lead-Free Solder Process Development
Herausgegeben von Henshall, Greg; Bath, Jasbir; Handwerker, Carol A.
Lead-Free Solder Process Development
Herausgegeben von Henshall, Greg; Bath, Jasbir; Handwerker, Carol A.
- Gebundenes Buch
- Merkliste
- Auf die Merkliste
- Bewerten Bewerten
- Teilen
- Produkt teilen
- Produkterinnerung
- Produkterinnerung
"Lead-free Solder Process Development," covers a list of key topics including: legislation, soldering fluxes, SMT, wave, rework, alloys, component finishes, reliability, EDXRF, and standards. It is intended as a reference guide to engineers in the industry who are or who will be migrating to lead-free soldering. It is not intended to be an exhaustive review of the literature but to be a practical reference guide for selected, key subject areas. Each subject area is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to…mehr
Andere Kunden interessierten sich auch für
- Lead-Free Soldering Process Development and Reliability144,99 €
- Michael G. PechtLead-Free Electronics191,99 €
- Electrical Connectors159,99 €
- Sheng LiuLed Packaging for Lighting Applications184,99 €
- Mitigating Tin Whisker Risks149,99 €
- John W. EvansA Guide to Lead-free Solders92,99 €
- Sheng LiuModeling and Simulation for Pa184,99 €
-
-
-
"Lead-free Solder Process Development," covers a list of key topics including: legislation, soldering fluxes, SMT, wave, rework, alloys, component finishes, reliability, EDXRF, and standards. It is intended as a reference guide to engineers in the industry who are or who will be migrating to lead-free soldering. It is not intended to be an exhaustive review of the literature but to be a practical reference guide for selected, key subject areas. Each subject area is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering.
A practicing engineer will find the book of use as it goes into these topics in sufficient detail to make it informative and a good practical guide to address issues of concern in these areas. Chapters on Soldering Fluxes, Component Finishes, Alloys, EDXRF and certain areas on reliability have not been covered in sufficient detail in previous books, so the proposed book will be a timely reference for engineers in the field. The lead-free solder process window has been found to be smaller than for tin-lead, so a specific chapter is dedicated to Six Sigma process methodologies to help engineers approach lead-free soldering processes with better evaluation and process methodologies.
A practicing engineer will find the book of use as it goes into these topics in sufficient detail to make it informative and a good practical guide to address issues of concern in these areas. Chapters on Soldering Fluxes, Component Finishes, Alloys, EDXRF and certain areas on reliability have not been covered in sufficient detail in previous books, so the proposed book will be a timely reference for engineers in the field. The lead-free solder process window has been found to be smaller than for tin-lead, so a specific chapter is dedicated to Six Sigma process methodologies to help engineers approach lead-free soldering processes with better evaluation and process methodologies.
Produktdetails
- Produktdetails
- Verlag: Wiley & Sons
- 1. Auflage
- Seitenzahl: 284
- Erscheinungstermin: 29. März 2011
- Englisch
- Abmessung: 236mm x 160mm x 23mm
- Gewicht: 567g
- ISBN-13: 9780470410745
- ISBN-10: 0470410744
- Artikelnr.: 29927359
- Verlag: Wiley & Sons
- 1. Auflage
- Seitenzahl: 284
- Erscheinungstermin: 29. März 2011
- Englisch
- Abmessung: 236mm x 160mm x 23mm
- Gewicht: 567g
- ISBN-13: 9780470410745
- ISBN-10: 0470410744
- Artikelnr.: 29927359
GREGORY HENSHALL is Master Engineer at Hewlett-Packard Company in Palo Alto, California. He has more than twenty years' experience in materials research and development, including twelve years of experience with soldering alloys and electronics manufacturing and nine years focused on lead-free technology. Dr. Henshall currently serves as chair for the iNEMI (International Electronics Manufacturing Initiative) Lead-Free Alloy Alternatives Project. JASBIR BATH is the owner of Bath Technical Consultancy LLC in Fremont, California. He has over fifteen years' experience in research, design, development, and implementation in the areas of soldering, surface mount, and packaging technologies working for companies including Flextronics International/Solectron Corporation and ITRI (International Tin Research Institute). Bath has been chair of various iNEMI lead-free consortia involving OEMs, EMS, and component and material supplier companies on alloy selection, assembly, and rework. CAROL A. HANDWERKER is the Reinhardt Schuhmann Jr. Professor of Materials Engineering at Purdue University, Indiana. Previously, she was chief of the Metallurgy Division at the National Institute of Standards and Technology (NIST), where she participated in the NCMS (National Center for Manufacturing Sciences) Lead-Free Solder Project and co-chaired the iNEMI Lead-Free Alloy Selection Team. Dr. Handwerker is currently active on the iNEMI Technical, Research, and Environmental Leadership Steering Committees, as well as a participant in a range of iNEMI project teams.
Technical Reviewers. Preface. Introduction. Contributors. 1. Regulatory and
Voluntary Drivers for Environmental Improvement: Hazardous Substances,
Lifecycle Design and End of Life (John Hawley). 1.1 Introduction. 1.2
Substances of Environmental Concern. 1.3 Design for Environment/Energy
Efficiency. 1.4 Recycling and Take-back. 1.5 Summary. 1.6 References. 2.
Lead-free Surface Mount Technology (Jasbir Bath, Jennifer Nguyen and Sundar
Sethuraman). 2.1 Introduction. 2.2 No-clean and Water-soluble Lead-free
Pastes. 2.3 Solder Paste Handling. 2.4 Board and Stencil Design. 2.5 Screen
Printing and Printability of Lead-free Solder Pastes. 2.6 Paste inspection.
2.7 Component Placement (Paste Tackiness). 2.8 Reflow Soldering and the
Reflow Profile. 2.9 Effect of Nitrogen versus Air Atmosphere during
Lead-free Reflow. 2.10 Head-in-Pillow Component Soldering Defect. 2.11
Solder Joint Visual Inspection. 2.12 AOI (Automated Optical Inspection).
2.13 X-ray Inspection. 2.14 ICT/Functional Testing. 2.15 Conclusions. 2.16
Future Work. 2.17 Acknowledgements. 2.18 References. 3. Lead-free Wave
Soldering (Dennis Barbini and Jasbir Bath). 3.0 Introduction. 3.1 Wave
soldering process boundaries. 3.2 Soldering temperatures on the chip and
main soldering waves. 3.3 Alloys for Lead-free Wave Soldering. 3.4 The
function of nitrogen in wave soldering. 3.5 The effect of PCB Design on
wave solder joint formation. 3.6 Standards related to wave soldering. 3.7
Conclusions. 3.8 Future work. 3.9 Acknowledgements. 3.10 References. 4.
Lead-free Rework (Alan Donaldson). 4.1 Introduction. 4.2 Surface Mount
Technology (SMT) Hand Soldering/Touch-up. 4.3 BGA/CSP Rework. 4.4 BGA
Socket Rework. 4.5 X-ray. 4.6 Through-hole Hand Soldering Rework. 4.7
Through-hole Mini-pot/Solder Fountain Rework. 4.8 Best Practices and Rework
Equipment Calibrations. 4.9 Conclusions. 4.10 Future Work. 4.11 References.
5 Lead-Free Alloys for BGA/CSP Components (Gregory A. Henshall). 5.1
Introduction. 5.2 Overview of New Lead-Free Alloys. 5.3 Benefits of New
Alloys for BGAs and CSPs. 5.4 Technical Concerns . 5.5 Management of New
Alloys. 5.6 Future Work. 5.7 Summary and Conclusions. 5.8 Acknowledgements.
5.9 References. 6 Growth Mechanisms and Mitigation Strategies of Tin
Whisker Growth (Peng Su). 6.1 Introduction. 6.2 Role of stress in whisker
growth. 6.3 Understanding standard acceleration tests. 6.4 Plating process
optimization and other mitigation strategies. 6.5 Whisker growth on
board-mounted components. 6.6 Summary. 6.7 References. 7. Testability of
Lead-Free Printed Circuit Assemblies (Rosa D.Reinosa and Aileen M. Allen).
7.1 Introduction. 7.2 Contact Repeatability of Lead-Free Boards. 7.3 Probe
Wear and Contamination. 7.4 Board Flexure. 7.5 Conclusions. 7.6
Acknowledgments. 7.7 References. 8. Board-Level Solder Joint Reliability of
High Performance Computers under Mechanical Loading (Keith Newman). 8.1
Introduction. 8.2 Establishing PWB Strain Limits for Manufacturing. 8.3.
SMT Component Fracture Strength Characterization. 8.4 PWB Fracture Strength
Characterization. 8.5 PWB Strain Characterization. 8.6. Solder Joint
Fracture Prediction - Modeling. 8.7. Fracture Strength Optimization. 8.8
Conclusions. 8.9 Acknowledgments. 8.10 References. 9. Lead-Free Reliability
in Aerospace/Military Environments (Thomas A. Woodrow and Jasbir Bath). 9.1
Introduction. 9.2 Aerospace/Military Consortia. 9.3 Lead-Free Control Plans
for Aerospace/Military Electronics. 9.4 Aerospace/Military Lead-Free
Reliability Concerns. 9.5 Summary and Conclusions. 9.6 References. 10.
Lead-Free Reliability in Automotive Environments (Richard D. Parke). 10.1
Introduction to Electronics in Automotive Environments. 10.2 Performance
Risks and Issues. 10.3 Legislation Driving Lead-Free Automotive
Electronics. 10.4 Reliability Requirements for Automotive Environments.
10.5 Failure Modes of Lead-free Joints. 10.6 Impact to Lead-free Component
Procurement and Management. 10.7 Change versus Risks. 10.8 Summary and
Conclusions. References. Index.
Voluntary Drivers for Environmental Improvement: Hazardous Substances,
Lifecycle Design and End of Life (John Hawley). 1.1 Introduction. 1.2
Substances of Environmental Concern. 1.3 Design for Environment/Energy
Efficiency. 1.4 Recycling and Take-back. 1.5 Summary. 1.6 References. 2.
Lead-free Surface Mount Technology (Jasbir Bath, Jennifer Nguyen and Sundar
Sethuraman). 2.1 Introduction. 2.2 No-clean and Water-soluble Lead-free
Pastes. 2.3 Solder Paste Handling. 2.4 Board and Stencil Design. 2.5 Screen
Printing and Printability of Lead-free Solder Pastes. 2.6 Paste inspection.
2.7 Component Placement (Paste Tackiness). 2.8 Reflow Soldering and the
Reflow Profile. 2.9 Effect of Nitrogen versus Air Atmosphere during
Lead-free Reflow. 2.10 Head-in-Pillow Component Soldering Defect. 2.11
Solder Joint Visual Inspection. 2.12 AOI (Automated Optical Inspection).
2.13 X-ray Inspection. 2.14 ICT/Functional Testing. 2.15 Conclusions. 2.16
Future Work. 2.17 Acknowledgements. 2.18 References. 3. Lead-free Wave
Soldering (Dennis Barbini and Jasbir Bath). 3.0 Introduction. 3.1 Wave
soldering process boundaries. 3.2 Soldering temperatures on the chip and
main soldering waves. 3.3 Alloys for Lead-free Wave Soldering. 3.4 The
function of nitrogen in wave soldering. 3.5 The effect of PCB Design on
wave solder joint formation. 3.6 Standards related to wave soldering. 3.7
Conclusions. 3.8 Future work. 3.9 Acknowledgements. 3.10 References. 4.
Lead-free Rework (Alan Donaldson). 4.1 Introduction. 4.2 Surface Mount
Technology (SMT) Hand Soldering/Touch-up. 4.3 BGA/CSP Rework. 4.4 BGA
Socket Rework. 4.5 X-ray. 4.6 Through-hole Hand Soldering Rework. 4.7
Through-hole Mini-pot/Solder Fountain Rework. 4.8 Best Practices and Rework
Equipment Calibrations. 4.9 Conclusions. 4.10 Future Work. 4.11 References.
5 Lead-Free Alloys for BGA/CSP Components (Gregory A. Henshall). 5.1
Introduction. 5.2 Overview of New Lead-Free Alloys. 5.3 Benefits of New
Alloys for BGAs and CSPs. 5.4 Technical Concerns . 5.5 Management of New
Alloys. 5.6 Future Work. 5.7 Summary and Conclusions. 5.8 Acknowledgements.
5.9 References. 6 Growth Mechanisms and Mitigation Strategies of Tin
Whisker Growth (Peng Su). 6.1 Introduction. 6.2 Role of stress in whisker
growth. 6.3 Understanding standard acceleration tests. 6.4 Plating process
optimization and other mitigation strategies. 6.5 Whisker growth on
board-mounted components. 6.6 Summary. 6.7 References. 7. Testability of
Lead-Free Printed Circuit Assemblies (Rosa D.Reinosa and Aileen M. Allen).
7.1 Introduction. 7.2 Contact Repeatability of Lead-Free Boards. 7.3 Probe
Wear and Contamination. 7.4 Board Flexure. 7.5 Conclusions. 7.6
Acknowledgments. 7.7 References. 8. Board-Level Solder Joint Reliability of
High Performance Computers under Mechanical Loading (Keith Newman). 8.1
Introduction. 8.2 Establishing PWB Strain Limits for Manufacturing. 8.3.
SMT Component Fracture Strength Characterization. 8.4 PWB Fracture Strength
Characterization. 8.5 PWB Strain Characterization. 8.6. Solder Joint
Fracture Prediction - Modeling. 8.7. Fracture Strength Optimization. 8.8
Conclusions. 8.9 Acknowledgments. 8.10 References. 9. Lead-Free Reliability
in Aerospace/Military Environments (Thomas A. Woodrow and Jasbir Bath). 9.1
Introduction. 9.2 Aerospace/Military Consortia. 9.3 Lead-Free Control Plans
for Aerospace/Military Electronics. 9.4 Aerospace/Military Lead-Free
Reliability Concerns. 9.5 Summary and Conclusions. 9.6 References. 10.
Lead-Free Reliability in Automotive Environments (Richard D. Parke). 10.1
Introduction to Electronics in Automotive Environments. 10.2 Performance
Risks and Issues. 10.3 Legislation Driving Lead-Free Automotive
Electronics. 10.4 Reliability Requirements for Automotive Environments.
10.5 Failure Modes of Lead-free Joints. 10.6 Impact to Lead-free Component
Procurement and Management. 10.7 Change versus Risks. 10.8 Summary and
Conclusions. References. Index.
Technical Reviewers. Preface. Introduction. Contributors. 1. Regulatory and
Voluntary Drivers for Environmental Improvement: Hazardous Substances,
Lifecycle Design and End of Life (John Hawley). 1.1 Introduction. 1.2
Substances of Environmental Concern. 1.3 Design for Environment/Energy
Efficiency. 1.4 Recycling and Take-back. 1.5 Summary. 1.6 References. 2.
Lead-free Surface Mount Technology (Jasbir Bath, Jennifer Nguyen and Sundar
Sethuraman). 2.1 Introduction. 2.2 No-clean and Water-soluble Lead-free
Pastes. 2.3 Solder Paste Handling. 2.4 Board and Stencil Design. 2.5 Screen
Printing and Printability of Lead-free Solder Pastes. 2.6 Paste inspection.
2.7 Component Placement (Paste Tackiness). 2.8 Reflow Soldering and the
Reflow Profile. 2.9 Effect of Nitrogen versus Air Atmosphere during
Lead-free Reflow. 2.10 Head-in-Pillow Component Soldering Defect. 2.11
Solder Joint Visual Inspection. 2.12 AOI (Automated Optical Inspection).
2.13 X-ray Inspection. 2.14 ICT/Functional Testing. 2.15 Conclusions. 2.16
Future Work. 2.17 Acknowledgements. 2.18 References. 3. Lead-free Wave
Soldering (Dennis Barbini and Jasbir Bath). 3.0 Introduction. 3.1 Wave
soldering process boundaries. 3.2 Soldering temperatures on the chip and
main soldering waves. 3.3 Alloys for Lead-free Wave Soldering. 3.4 The
function of nitrogen in wave soldering. 3.5 The effect of PCB Design on
wave solder joint formation. 3.6 Standards related to wave soldering. 3.7
Conclusions. 3.8 Future work. 3.9 Acknowledgements. 3.10 References. 4.
Lead-free Rework (Alan Donaldson). 4.1 Introduction. 4.2 Surface Mount
Technology (SMT) Hand Soldering/Touch-up. 4.3 BGA/CSP Rework. 4.4 BGA
Socket Rework. 4.5 X-ray. 4.6 Through-hole Hand Soldering Rework. 4.7
Through-hole Mini-pot/Solder Fountain Rework. 4.8 Best Practices and Rework
Equipment Calibrations. 4.9 Conclusions. 4.10 Future Work. 4.11 References.
5 Lead-Free Alloys for BGA/CSP Components (Gregory A. Henshall). 5.1
Introduction. 5.2 Overview of New Lead-Free Alloys. 5.3 Benefits of New
Alloys for BGAs and CSPs. 5.4 Technical Concerns . 5.5 Management of New
Alloys. 5.6 Future Work. 5.7 Summary and Conclusions. 5.8 Acknowledgements.
5.9 References. 6 Growth Mechanisms and Mitigation Strategies of Tin
Whisker Growth (Peng Su). 6.1 Introduction. 6.2 Role of stress in whisker
growth. 6.3 Understanding standard acceleration tests. 6.4 Plating process
optimization and other mitigation strategies. 6.5 Whisker growth on
board-mounted components. 6.6 Summary. 6.7 References. 7. Testability of
Lead-Free Printed Circuit Assemblies (Rosa D.Reinosa and Aileen M. Allen).
7.1 Introduction. 7.2 Contact Repeatability of Lead-Free Boards. 7.3 Probe
Wear and Contamination. 7.4 Board Flexure. 7.5 Conclusions. 7.6
Acknowledgments. 7.7 References. 8. Board-Level Solder Joint Reliability of
High Performance Computers under Mechanical Loading (Keith Newman). 8.1
Introduction. 8.2 Establishing PWB Strain Limits for Manufacturing. 8.3.
SMT Component Fracture Strength Characterization. 8.4 PWB Fracture Strength
Characterization. 8.5 PWB Strain Characterization. 8.6. Solder Joint
Fracture Prediction - Modeling. 8.7. Fracture Strength Optimization. 8.8
Conclusions. 8.9 Acknowledgments. 8.10 References. 9. Lead-Free Reliability
in Aerospace/Military Environments (Thomas A. Woodrow and Jasbir Bath). 9.1
Introduction. 9.2 Aerospace/Military Consortia. 9.3 Lead-Free Control Plans
for Aerospace/Military Electronics. 9.4 Aerospace/Military Lead-Free
Reliability Concerns. 9.5 Summary and Conclusions. 9.6 References. 10.
Lead-Free Reliability in Automotive Environments (Richard D. Parke). 10.1
Introduction to Electronics in Automotive Environments. 10.2 Performance
Risks and Issues. 10.3 Legislation Driving Lead-Free Automotive
Electronics. 10.4 Reliability Requirements for Automotive Environments.
10.5 Failure Modes of Lead-free Joints. 10.6 Impact to Lead-free Component
Procurement and Management. 10.7 Change versus Risks. 10.8 Summary and
Conclusions. References. Index.
Voluntary Drivers for Environmental Improvement: Hazardous Substances,
Lifecycle Design and End of Life (John Hawley). 1.1 Introduction. 1.2
Substances of Environmental Concern. 1.3 Design for Environment/Energy
Efficiency. 1.4 Recycling and Take-back. 1.5 Summary. 1.6 References. 2.
Lead-free Surface Mount Technology (Jasbir Bath, Jennifer Nguyen and Sundar
Sethuraman). 2.1 Introduction. 2.2 No-clean and Water-soluble Lead-free
Pastes. 2.3 Solder Paste Handling. 2.4 Board and Stencil Design. 2.5 Screen
Printing and Printability of Lead-free Solder Pastes. 2.6 Paste inspection.
2.7 Component Placement (Paste Tackiness). 2.8 Reflow Soldering and the
Reflow Profile. 2.9 Effect of Nitrogen versus Air Atmosphere during
Lead-free Reflow. 2.10 Head-in-Pillow Component Soldering Defect. 2.11
Solder Joint Visual Inspection. 2.12 AOI (Automated Optical Inspection).
2.13 X-ray Inspection. 2.14 ICT/Functional Testing. 2.15 Conclusions. 2.16
Future Work. 2.17 Acknowledgements. 2.18 References. 3. Lead-free Wave
Soldering (Dennis Barbini and Jasbir Bath). 3.0 Introduction. 3.1 Wave
soldering process boundaries. 3.2 Soldering temperatures on the chip and
main soldering waves. 3.3 Alloys for Lead-free Wave Soldering. 3.4 The
function of nitrogen in wave soldering. 3.5 The effect of PCB Design on
wave solder joint formation. 3.6 Standards related to wave soldering. 3.7
Conclusions. 3.8 Future work. 3.9 Acknowledgements. 3.10 References. 4.
Lead-free Rework (Alan Donaldson). 4.1 Introduction. 4.2 Surface Mount
Technology (SMT) Hand Soldering/Touch-up. 4.3 BGA/CSP Rework. 4.4 BGA
Socket Rework. 4.5 X-ray. 4.6 Through-hole Hand Soldering Rework. 4.7
Through-hole Mini-pot/Solder Fountain Rework. 4.8 Best Practices and Rework
Equipment Calibrations. 4.9 Conclusions. 4.10 Future Work. 4.11 References.
5 Lead-Free Alloys for BGA/CSP Components (Gregory A. Henshall). 5.1
Introduction. 5.2 Overview of New Lead-Free Alloys. 5.3 Benefits of New
Alloys for BGAs and CSPs. 5.4 Technical Concerns . 5.5 Management of New
Alloys. 5.6 Future Work. 5.7 Summary and Conclusions. 5.8 Acknowledgements.
5.9 References. 6 Growth Mechanisms and Mitigation Strategies of Tin
Whisker Growth (Peng Su). 6.1 Introduction. 6.2 Role of stress in whisker
growth. 6.3 Understanding standard acceleration tests. 6.4 Plating process
optimization and other mitigation strategies. 6.5 Whisker growth on
board-mounted components. 6.6 Summary. 6.7 References. 7. Testability of
Lead-Free Printed Circuit Assemblies (Rosa D.Reinosa and Aileen M. Allen).
7.1 Introduction. 7.2 Contact Repeatability of Lead-Free Boards. 7.3 Probe
Wear and Contamination. 7.4 Board Flexure. 7.5 Conclusions. 7.6
Acknowledgments. 7.7 References. 8. Board-Level Solder Joint Reliability of
High Performance Computers under Mechanical Loading (Keith Newman). 8.1
Introduction. 8.2 Establishing PWB Strain Limits for Manufacturing. 8.3.
SMT Component Fracture Strength Characterization. 8.4 PWB Fracture Strength
Characterization. 8.5 PWB Strain Characterization. 8.6. Solder Joint
Fracture Prediction - Modeling. 8.7. Fracture Strength Optimization. 8.8
Conclusions. 8.9 Acknowledgments. 8.10 References. 9. Lead-Free Reliability
in Aerospace/Military Environments (Thomas A. Woodrow and Jasbir Bath). 9.1
Introduction. 9.2 Aerospace/Military Consortia. 9.3 Lead-Free Control Plans
for Aerospace/Military Electronics. 9.4 Aerospace/Military Lead-Free
Reliability Concerns. 9.5 Summary and Conclusions. 9.6 References. 10.
Lead-Free Reliability in Automotive Environments (Richard D. Parke). 10.1
Introduction to Electronics in Automotive Environments. 10.2 Performance
Risks and Issues. 10.3 Legislation Driving Lead-Free Automotive
Electronics. 10.4 Reliability Requirements for Automotive Environments.
10.5 Failure Modes of Lead-free Joints. 10.6 Impact to Lead-free Component
Procurement and Management. 10.7 Change versus Risks. 10.8 Summary and
Conclusions. References. Index.