The fabrication of MEMS has been predominately achieved by etching the polysilicon material. However, new materials are in large demands that could overcome the hurdles in fabrication or manufacturing process. Although, an enormous amount of work being accomplished in the area, most of the information is treated as confidential or privileged. It is extremely hard to find the meaningful information for the new or related developments. This book is collection of chapters written by experts in MEMS and NEMS technology. Chapters are contributed on the development of new MEMS and NEMS materials as…mehr
The fabrication of MEMS has been predominately achieved by etching the polysilicon material. However, new materials are in large demands that could overcome the hurdles in fabrication or manufacturing process. Although, an enormous amount of work being accomplished in the area, most of the information is treated as confidential or privileged. It is extremely hard to find the meaningful information for the new or related developments. This book is collection of chapters written by experts in MEMS and NEMS technology. Chapters are contributed on the development of new MEMS and NEMS materials as well as on the properties of these devices. Important properties such as residual stresses and buckling behavior in the devices are discussed as separate chapters. Various models have been included in the chapters that studies the mode and mechanism of failure of the MEMS and NEMS. This book is meant for the graduate students, research scholars and engineers who are involved in the research and developments of advanced MEMS and NEMS for a wide variety of applications. Critical information has been included for the readers that will help them in gaining precise control over dimensional stability, quality, reliability, productivity and maintenance in MEMS and NEMS. No such book is available in the market that addresses the developments and failures in these advanced devices.Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Dr. Atul Tiwari is a research faculty member in the Department of Mechanical Engineering at the University of Hawaii, USA. He has received Ph.D. in Polymer Materials Science along with the bestowed Chartered Chemist and Chartered Scientist status from the Royal Society of Chemistry, UK. Dr. Tiwari is an active member of several professional bodies in the UK, USA, and India. Being an organic chemist and mechanical engineer his research work tends to bridge the gap between the science and engineering. Dr. Tiwari has published more than sixty peer reviewed research publications. His area of research interest includes the development of smart materials including silicones, graphene and bio-inspired biomaterials for industrial applications. Dr. Tiwari zeal to develop new materials and has generated six international patented/pending technologies that have been transferred to the industries. He is an active consultant to renowned companies and acts as associate editor of international journals. Baldev Raj is a distinguished scientist and former director of Indira Gandhi Centre of Atomic Research, India. He has pioneered the application of Non Destructive Testing (NDT) for basic research using acoustic and electromagnetic techniques in a variety of materials and components. He is currently President, International Institute of Welding, President, Indian National Academy of Engineering and President-Research PSG Institutions, Coimbatore. He is a member of the Scientific Advisory Council to Prime Minister, Scientific Advisory Council to Cabinet, Nano Mission Council of India and Apex Advisory Committee, Ministry of Human Resources Development. He is Chairman, Board of Governors, IIT, Gandhinagar & NIT, Puduchery. He has authored of more than 850 publications in referred journals, 60 books and special journal volumes, more than 20 contributions to encyclopaedia and handbooks, as well as the owner of 21 patents. He has been recognized with more than 100 international and national awards.
Inhaltsangabe
1 Carbon as a MEMS Material 1 Amritha Rammohan and Ashutosh Sharma 1.1 Introduction 1 1.2 Structure and Properties of Glassy Carbon 3 1.3 Fabrication of C-MEMS Structures 4 1.4 Integration of C-MEMS Structures with Other Materials 15 1.5 Conclusion 18 2 Intelligent Model-Based Fault Diagnosis of MEMS 21 Afshin Izadian 2.1 Introduction 21 2.2 Model-Based Fault Diagnosis 29 2.3 Self-Tuning Estimation 49 3 MEMS Heat Exchangers 63 B. Mathew and L. Weiss 3.1 Introduction 63 3.2 Fundamentals of Thermodynamics, Fluid Mechanics, and Heat Transfer 67 3.3 MEMS Heat Sinks 86 3.4 MEMS Heat Pipes 92 3.6 Need for Microscale Internal Flow Passages 113 4 Application of Porous Silicon in MEMS and Sensors Technology 121 L. Sujatha, Chirasree Roy Chaudhuri and Enakshi Bhattacharya 4.1 Introduction 121 4.2 Porous Silicon in Biosensors 131 4.3 Porous Silicon for Pressure Sensors 155 4.4 Conclusion 165 5 MEMS/NEMS Switches with Silicon to Silicon (Si-to-Si) Contact Interface 173 Chengkuo Lee, Bo Woon Soon and You Qian 5.1 Introduction 173 5.2 Bi-Stable CMOS Front End Silicon Nanofin (SiNF) Switch for Non-volatile Memory Based On Van Der Waals Force 175 5.3 Vertically Actuated U-Shape Nanowire NEMS Switch 184 5.4 A Vacuum Encapsulated Si-to-Si MEMS Switch for Rugged Electronics 187 5.5 Summary 197 6 On the Design, Fabrication, and Characterization of cMUT Devices 201 J. Jayapandian, K. Prabakar, C.S. Sundar and Baldev Raj 6.1 Introduction 201 6.2 cMUT Design and Finite Element Modeling Simulation 203 6.3 cMUT Fabrication and Characterization 205 6.4 Summary and Conclusions 216 7 Inverse Problems in the MEMS/NEMS Applications 219 Yin Zhang 7.1 Introduction 219 7.2 Inverse Problems in the Micro/Nanomechanical Resonators 222 7.3 Inverse Problems in the MEMS Stiction Test 231 8 Ohmic RF-MEMS Control 239 M. Spasos and R. Nilavalan 8.1 Introduction 239 8.2 Charge Drive Control (Resistive Damping) 251 8.3 Hybrid Drive Control 255 8.4 Control Under High-Pressure Gas Damping 258 8.5 Comparison between Different Control Modes 258 9 Dynamics of MEMS Devices 263 Vamsy Godthi, K. Jayaprakash Reddy and Rudra Pratap 9.1 Introduction 263 9.2 Modeling and Simulation 266 9.3 Fabrication Methods 273 9.4 Characterization 276 9.5 Device Failures 280 10 Buckling Behaviors and Interfacial Toughness of a Micron-Scale Composite Structure with a Metal Wire on a Flexible Substrate 285 Qinghua Wang, Huimin Xie and Yanjie Li 10.1 Introduction 285 10.2 Buckling Behaviors of Constantan Wire under Electrical Loading 289 10.3 Interfacial Toughness between Constantan Wire and Polymer Substrate 305 10.4 Buckling Behaviors of Polymer Substrate Restricted by Constantan Wire 310 10.5 Conclusions 321 11 Microcantilever-Based Nano-Electro-Mechanical Sensor Systems: Characterization, Instrumentation, and Applications 325 Sheetal Patil and V. Ramgopal Rao 11.1 Introduction 325 11.2 Operation Principle and Fundamental Models 327 11.3 Microcantilever Sensor Fabrication 330 11.4 Mechanical and Electrical Characterization of Microcantilevers 335 11.5 Readout Principles 339 11.6 Application of Microcantilever Sensors 344 11.7 Energy Harvesting for Sensor Networks 349 11.8 Conclusion 351 12 CMOS MEMS Integration 361 Thejas and Navakanta Bhat 12.1 Introduction 361 12.2 State-of-the-Art inertial Sensor 362 12.3 Capacitance Sensing Techniques 366 12.4 Capacitance Sensing Architectures 367 12.5 Continuous Time Voltage Sensing Circuit 368 12.6 CMOS ASIC Design 371 12.7 Test Results of CMOS-MEMS Integration 377 12.8 Electrical Reliability Issues 378 13 Solving Quality and Reliability Optimization Problems for MEMS with Degradation Data 381 Yash Lundia, Kunal Jain, Mamanduru Vamsee Krishna, Manoj Kumar Tiwari and Baldev Raj 13.1 Introduction 382 13.2 Notations and Assumptions 384 13.3 Reliability Model 385 13.4 Numerical Example 395 13.5 Conclusions 397 References 397
1 Carbon as a MEMS Material 1 Amritha Rammohan and Ashutosh Sharma 1.1 Introduction 1 1.2 Structure and Properties of Glassy Carbon 3 1.3 Fabrication of C-MEMS Structures 4 1.4 Integration of C-MEMS Structures with Other Materials 15 1.5 Conclusion 18 2 Intelligent Model-Based Fault Diagnosis of MEMS 21 Afshin Izadian 2.1 Introduction 21 2.2 Model-Based Fault Diagnosis 29 2.3 Self-Tuning Estimation 49 3 MEMS Heat Exchangers 63 B. Mathew and L. Weiss 3.1 Introduction 63 3.2 Fundamentals of Thermodynamics, Fluid Mechanics, and Heat Transfer 67 3.3 MEMS Heat Sinks 86 3.4 MEMS Heat Pipes 92 3.6 Need for Microscale Internal Flow Passages 113 4 Application of Porous Silicon in MEMS and Sensors Technology 121 L. Sujatha, Chirasree Roy Chaudhuri and Enakshi Bhattacharya 4.1 Introduction 121 4.2 Porous Silicon in Biosensors 131 4.3 Porous Silicon for Pressure Sensors 155 4.4 Conclusion 165 5 MEMS/NEMS Switches with Silicon to Silicon (Si-to-Si) Contact Interface 173 Chengkuo Lee, Bo Woon Soon and You Qian 5.1 Introduction 173 5.2 Bi-Stable CMOS Front End Silicon Nanofin (SiNF) Switch for Non-volatile Memory Based On Van Der Waals Force 175 5.3 Vertically Actuated U-Shape Nanowire NEMS Switch 184 5.4 A Vacuum Encapsulated Si-to-Si MEMS Switch for Rugged Electronics 187 5.5 Summary 197 6 On the Design, Fabrication, and Characterization of cMUT Devices 201 J. Jayapandian, K. Prabakar, C.S. Sundar and Baldev Raj 6.1 Introduction 201 6.2 cMUT Design and Finite Element Modeling Simulation 203 6.3 cMUT Fabrication and Characterization 205 6.4 Summary and Conclusions 216 7 Inverse Problems in the MEMS/NEMS Applications 219 Yin Zhang 7.1 Introduction 219 7.2 Inverse Problems in the Micro/Nanomechanical Resonators 222 7.3 Inverse Problems in the MEMS Stiction Test 231 8 Ohmic RF-MEMS Control 239 M. Spasos and R. Nilavalan 8.1 Introduction 239 8.2 Charge Drive Control (Resistive Damping) 251 8.3 Hybrid Drive Control 255 8.4 Control Under High-Pressure Gas Damping 258 8.5 Comparison between Different Control Modes 258 9 Dynamics of MEMS Devices 263 Vamsy Godthi, K. Jayaprakash Reddy and Rudra Pratap 9.1 Introduction 263 9.2 Modeling and Simulation 266 9.3 Fabrication Methods 273 9.4 Characterization 276 9.5 Device Failures 280 10 Buckling Behaviors and Interfacial Toughness of a Micron-Scale Composite Structure with a Metal Wire on a Flexible Substrate 285 Qinghua Wang, Huimin Xie and Yanjie Li 10.1 Introduction 285 10.2 Buckling Behaviors of Constantan Wire under Electrical Loading 289 10.3 Interfacial Toughness between Constantan Wire and Polymer Substrate 305 10.4 Buckling Behaviors of Polymer Substrate Restricted by Constantan Wire 310 10.5 Conclusions 321 11 Microcantilever-Based Nano-Electro-Mechanical Sensor Systems: Characterization, Instrumentation, and Applications 325 Sheetal Patil and V. Ramgopal Rao 11.1 Introduction 325 11.2 Operation Principle and Fundamental Models 327 11.3 Microcantilever Sensor Fabrication 330 11.4 Mechanical and Electrical Characterization of Microcantilevers 335 11.5 Readout Principles 339 11.6 Application of Microcantilever Sensors 344 11.7 Energy Harvesting for Sensor Networks 349 11.8 Conclusion 351 12 CMOS MEMS Integration 361 Thejas and Navakanta Bhat 12.1 Introduction 361 12.2 State-of-the-Art inertial Sensor 362 12.3 Capacitance Sensing Techniques 366 12.4 Capacitance Sensing Architectures 367 12.5 Continuous Time Voltage Sensing Circuit 368 12.6 CMOS ASIC Design 371 12.7 Test Results of CMOS-MEMS Integration 377 12.8 Electrical Reliability Issues 378 13 Solving Quality and Reliability Optimization Problems for MEMS with Degradation Data 381 Yash Lundia, Kunal Jain, Mamanduru Vamsee Krishna, Manoj Kumar Tiwari and Baldev Raj 13.1 Introduction 382 13.2 Notations and Assumptions 384 13.3 Reliability Model 385 13.4 Numerical Example 395 13.5 Conclusions 397 References 397
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