The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
John H. Lau received his Ph.D. degree in Theoretical and Applied Mechanics from the University of Illinois (1977), a M.A.Sc. degree in Structural Engineering from the University of British Columbia (1973), a second M.S. degree in Engineering Physics from the University of Wisconsin (1974), and a third M.S. degree in Management Science from Fairleigh Dickinson University (1981). He also has a B.E. degree in Civil Engineering from National Taiwan University (1970). John is an interconnection technology scientist at Agilent Technologies, Inc. His current interests cover a broad range of electronic and optoelectronic packaging and manufacturing technology. Prior to Agilent, he worked for Express Packaging Systems, Hewlett-Packard Company, Sandia National Laboratory, Bechtel Power Corporation, and Exxon Production and Research Company. With more than 30 years of R&D and manufacturing experience in the electronics, petroleum, nuclear, and defense industries, he has given over 200 worksh
ops, authored and co-authored over 180 peer reviewed technical publications, and is the author and editor of numerous books.
Inhaltsangabe
Foreword Acknowldgement Introduction: the mechanics of soldere alloy interconnect Microstructural influences on the mechanical properties of solder Interfaces and intermetallics Constitutivemodels Prediction of solder joint geometry Life prediction and accelerated testing Thermomechanical modeling of solder joints - numerical considerations Applications - through-hole Surface mount solder joints under thermal, mechanical, and vibration conditions Index
Foreword Acknowldgement Introduction: the mechanics of soldere alloy interconnect Microstructural influences on the mechanical properties of solder Interfaces and intermetallics Constitutivemodels Prediction of solder joint geometry Life prediction and accelerated testing Thermomechanical modeling of solder joints - numerical considerations Applications - through-hole Surface mount solder joints under thermal, mechanical, and vibration conditions Index
Es gelten unsere Allgemeinen Geschäftsbedingungen: www.buecher.de/agb
Impressum
www.buecher.de ist ein Internetauftritt der buecher.de internetstores GmbH
Geschäftsführung: Monica Sawhney | Roland Kölbl | Günter Hilger
Sitz der Gesellschaft: Batheyer Straße 115 - 117, 58099 Hagen
Postanschrift: Bürgermeister-Wegele-Str. 12, 86167 Augsburg
Amtsgericht Hagen HRB 13257
Steuernummer: 321/5800/1497
