MEMS and Nanotechnology, Volume 4
Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics
Herausgegeben:Proulx, Tom
MEMS and Nanotechnology, Volume 4
Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics
Herausgegeben:Proulx, Tom
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MEMS and Nanotechnology, Volume 4 represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011. The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.…mehr
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MEMS and Nanotechnology, Volume 4 represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011. The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.
Produktdetails
- Produktdetails
- Conference Proceedings of the Society for Experimental Mechanics Series 4
- Verlag: Springer / Springer New York / Springer, Berlin
- Artikelnr. des Verlages: 978-1-4614-2898-5
- 2011
- Seitenzahl: 200
- Erscheinungstermin: 14. Juli 2013
- Englisch
- Abmessung: 279mm x 210mm x 12mm
- Gewicht: 502g
- ISBN-13: 9781461428985
- ISBN-10: 146142898X
- Artikelnr.: 38512858
- Herstellerkennzeichnung Die Herstellerinformationen sind derzeit nicht verfügbar.
- Conference Proceedings of the Society for Experimental Mechanics Series 4
- Verlag: Springer / Springer New York / Springer, Berlin
- Artikelnr. des Verlages: 978-1-4614-2898-5
- 2011
- Seitenzahl: 200
- Erscheinungstermin: 14. Juli 2013
- Englisch
- Abmessung: 279mm x 210mm x 12mm
- Gewicht: 502g
- ISBN-13: 9781461428985
- ISBN-10: 146142898X
- Artikelnr.: 38512858
- Herstellerkennzeichnung Die Herstellerinformationen sind derzeit nicht verfügbar.
Dr. Tom Proulx is the Executive Director of the Society for Experimental Mechanics, Inc.
Integrated Process Feasibility of Hard-mask for Tight Pitch Interconnects Fabrication.- Thermoelectric Effects in Current Induced Crystallization of Silicon Microstructures.- Evaluation of Resistance Measurement Techniques in Carbon Black and Carbon.- Nano-tubes Reinforced Epoxy.- A Nano-tensile Tester for Creep Studies.- The Measurement of Cyclic Creep Behavior in Copper Thin Film Using Microtensile Testing.- New Insight Into Pile-Up in Thin Film Indentation.- Measuring Substrate-independent Young's Modulus of Thin Films.- Analysis of Spherical Indentation of an Elastic Bilayer Using a Modified Perturbation Approach.- Nano-indentation Studies of Polyglactin 910 Monofilament Sutures.- Analytical Approach for the Determination of Nanomechanical Properties for Metals.- Advances in Thin Film Indentation.- Cyclic Nanoindentation Shakedown of Muscovite and its Elastic Modulus Measurement.- Assessment of Digital Holography for 3D-shape Measurement of Micro Deep Drawing Parts in Comparison to Confocal Microscopy.- Full-field Bulge Testing Using Global Digital Image Correlation.- Experimental Investigation of Deformation Mechanisms Present in Ultrafine-grained Metals.- Characterization of a Variation on AFIT's Tunable MEMS Cantilever Array Metamaterial.- MEMS for Real-time Infrared Imaging.- New Insights Into Enhancing Microcantilever MEMS Sensors.- A Miniature MRI-compatible Fiber-optic Force Sensor Utilizing Fabry-Perot Interferometer.- Micromechanical Structure With Stable Linear Positive and Negative Stiffness.- Terahertz Metamaterial Structures Fabricated by PolyMUMPs.- Investigations Into 1D and 2D Metamaterials at Infrared Wavelengths.- MEMS Integrated Metamaterials With Variable Resonance Operating at RF Frequencies.- Creep Measurements in Free-standing Thin Metal Film Micro-cantilever Bending.- MEMS Reliability for Space Applications by Elimination of Potential Failure Modes Through Analysis.- Analysis and Evaluation Methods Associated With theApplication of Compliant Thermal Interface Materials in Multi-chip Electronic Board Assemblies.- Hierarchical Reliability Model for Life Prediction of Actively Cooled LED-based Luminaire.- Direct Determination of Interfacial Traction-separation Relations in Chip-package Systems
Integrated Process Feasibility of Hard-mask for Tight Pitch Interconnects Fabrication.- Thermoelectric Effects in Current Induced Crystallization of Silicon Microstructures.- Evaluation of Resistance Measurement Techniques in Carbon Black and Carbon.- Nano-tubes Reinforced Epoxy.- A Nano-tensile Tester for Creep Studies.- The Measurement of Cyclic Creep Behavior in Copper Thin Film Using Microtensile Testing.- New Insight Into Pile-Up in Thin Film Indentation.- Measuring Substrate-independent Young's Modulus of Thin Films.- Analysis of Spherical Indentation of an Elastic Bilayer Using a Modified Perturbation Approach.- Nano-indentation Studies of Polyglactin 910 Monofilament Sutures.- Analytical Approach for the Determination of Nanomechanical Properties for Metals.- Advances in Thin Film Indentation.- Cyclic Nanoindentation Shakedown of Muscovite and its Elastic Modulus Measurement.- Assessment of Digital Holography for 3D-shape Measurement of Micro Deep Drawing Parts in Comparison to Confocal Microscopy.- Full-field Bulge Testing Using Global Digital Image Correlation.- Experimental Investigation of Deformation Mechanisms Present in Ultrafine-grained Metals.- Characterization of a Variation on AFIT's Tunable MEMS Cantilever Array Metamaterial.- MEMS for Real-time Infrared Imaging.- New Insights Into Enhancing Microcantilever MEMS Sensors.- A Miniature MRI-compatible Fiber-optic Force Sensor Utilizing Fabry-Perot Interferometer.- Micromechanical Structure With Stable Linear Positive and Negative Stiffness.- Terahertz Metamaterial Structures Fabricated by PolyMUMPs.- Investigations Into 1D and 2D Metamaterials at Infrared Wavelengths.- MEMS Integrated Metamaterials With Variable Resonance Operating at RF Frequencies.- Creep Measurements in Free-standing Thin Metal Film Micro-cantilever Bending.- MEMS Reliability for Space Applications by Elimination of Potential Failure Modes Through Analysis.- Analysis and Evaluation Methods Associated With theApplication of Compliant Thermal Interface Materials in Multi-chip Electronic Board Assemblies.- Hierarchical Reliability Model for Life Prediction of Actively Cooled LED-based Luminaire.- Direct Determination of Interfacial Traction-separation Relations in Chip-package Systems