Micro- and Nanoscale Phenomena in Tribology
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Based on presentations at the NSF Summer Institute on Nanomechanics, Nanomaterials, and Micro/Nanomanufacturing, this book presents the fundamentals of micro- and nanoscale phenomena associated with the tribological interface. Topics covered in the text include mechanics, surface science, state-of-the-art simulation, and experimental approaches. Expert contributors from research and academia examine the effects of surface roughness, as well as chemical interactions related to friction and wear performance. They also address mechanical contact and lubrication issues. Molecular dynamics…mehr

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Produktbeschreibung
Based on presentations at the NSF Summer Institute on Nanomechanics, Nanomaterials, and Micro/Nanomanufacturing, this book presents the fundamentals of micro- and nanoscale phenomena associated with the tribological interface. Topics covered in the text include mechanics, surface science, state-of-the-art simulation, and experimental approaches. Expert contributors from research and academia examine the effects of surface roughness, as well as chemical interactions related to friction and wear performance. They also address mechanical contact and lubrication issues. Molecular dynamics simulations illustrate nanoscale and microscale phenomena as they relate to real-world tribology phenomena.
With numerous examples and figures throughout, this volume presents a thorough account of important advancements in tribology that offer insight into micro- and nanoscale phenomena. Written by specialists from computation, materials science, mechanical engineering, surface physics, and chemistry, each chapter provides up-to-date coverage of both basic and advanced topics and includes extensive references for further study. By enabling a better understanding of fundamental micro- and nanoscale interactions, the book helps readers effectively design and fabricate durable tribological components for various engineering and biological systems.
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Autorenporträt
Yip-Wah Chung is a professor of materials science and engineering and mechanical engineering at Northwestern University. A fellow of ASM International, AVS, and STLE, Dr. Chung has received numerous honors, including the Ralph A. Teetor Engineering Educator Award from SAE, the Innovative Research Award and Best Paper Award from the ASME Tribology Division, and the Bronze Bauhinia Star from the Hong Kong Special Administrative Government. He earned a Ph.D. in physics from the University of California, Berkeley. His research interests encompass surface science, tribology, thin films, and alloy design.