Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
Herausgegeben: Suhir, Ephraim; Lee, Y.C.; Wong, C. P.
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The handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. Each chapter contains a summary of the state-of-the-art in a particular field and practical recommendations on how to apply current knowledge and technology to design, manufacture and operate a viable, reliable and cost-effective electronic component or photonic device, and on how to make such a device into a successful commercial product.
The handbook can be used as a reference and as a manual for self-education. Designed and written for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists - this will be an essential reference for all those who are interested in the state-of-the-art of micro- and opto-electronic materials, packaging , and reliability, with an emphasis on physical design problems, challenges, and solutions.
The handbook can be used as a reference and as a manual for self-education. Designed and written for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists - this will be an essential reference for all those who are interested in the state-of-the-art of micro- and opto-electronic materials, packaging , and reliability, with an emphasis on physical design problems, challenges, and solutions.
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions.
Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book.
Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book.
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