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Produktbild: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging

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468,99 € UVP 534,99 €

inkl. gesetzl. MwSt., Versandkostenfrei

Beschreibung

Produktdetails

Einband

Set mit diversen Artikeln

Erscheinungsdatum

29.05.2007

Abbildungen

LXII, 1460 p. In 2 volumes, not available separately.

Herausgeber

Ephraim Suhir + weitere

Verlag

Springer Us

Seitenzahl

1460

Maße (L/B/H)

26/18,3/9,3 cm

Gewicht

3216 g

Auflage

2007

Sprache

Englisch

ISBN

978-0-387-27974-9

Beschreibung

Rezension

From the reviews:



"The book contains 25 chapters written by experts, mainly drawn from the United States and Europe. The chapters contain good technical details and thorough reference lists, and most of the figures are high quality. … For those engaged in developing MOEMS products and similar activities, the acquisition of this book … will be a sound investment." (K. Alan Shore, Optics and Photonics News, November, 2007)

Produktdetails

Einband

Set mit diversen Artikeln

Erscheinungsdatum

29.05.2007

Abbildungen

LXII, 1460 p. In 2 volumes, not available separately.

Herausgeber

Verlag

Springer Us

Seitenzahl

1460

Maße (L/B/H)

26/18,3/9,3 cm

Gewicht

3216 g

Auflage

2007

Sprache

Englisch

ISBN

978-0-387-27974-9

Herstelleradresse

Springer-Verlag KG
Sachsenplatz 4-6
1201 Wien
AT

Email: ProductSafety@springernature.com

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  • Produktbild: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
  • Materials Physics.- Polymer Materials Characterization, Modeling and Application.- Thermo-Optic Effects in Polymer Bragg Gratings.- Photorefractive Materials and Devices for Passive Components in WDM Systems.- Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability.- Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges.- Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems.- Materials Mechanics.- Fiber Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension.- Area Array Technology for High Reliability Applications.- Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections.- Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections.- Fatigue Life Assessment for Lead-Free Solder Joints.- Lead-Free Solder Materials: Design For Reliability.- Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures.- Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods.- Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach.- Dynamic Response of Micro- and Opto-Electronic Systems to Shocks and Vibrations: Review and Extension.- Dynamic Physical Reliability in Application to Photonic Materials.- High-Speed Tensile Testing of Optical Fibers— New Understanding for Reliability Prediction.- The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior.- Effect of Material’s Nonlinearity on the Mechanical Response of some Piezoelectric and Photonic Systems.- Physical Design.- Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- andOpto-Electronic Systems: Role, Attributes, Challenges, Results.- Probabilistic Physical Design of Fiber-Optic Structures.- The Wirebonded Interconnect: A Mainstay for Electronics.- Metallurgical Interconnections for Extreme High and Low Temperature Environments.- Design, Process, and Reliability of Wafer Level Packaging.- Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow.- Reliability and Packaging.- Fundamentals of Reliability and Stress Testing.- How to Make a Device into a Product: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests.- Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique.- Interconnect Reliability Considerations in Portable Consumer Electronic Products.- MEMS Packaging and Reliability.- Advances in Optoelectronic Methodology for MOEMS Testing.- Durability of Optical Nanostructures: Laser Diode Structures and Packages, A Case Study.- Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board.- Adhesives for Micro- and Opto-Electronics Application: Chemistry, Reliability and Mechanics.- Multi-Stage Peel Tests and Evaluation of Interfacial Adhesion Strength for Micro- and Opto-Electronic Materials.- The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging.- Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications.- Adhesive Bonding of Passive Optical Components.- Electrically Conductive Adhesives: A Research Status Review.- Electrically Conductive Adhesives.- Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging.- Die Attach Quality Testing by StructureFunction Evaluation.- Mechanical Behavior of Flip Chip Packages under Thermal Loading.- Stress Analysis for Processed Silicon Wafers and Packaged Micro-devices.