The most complete, current guide to semiconductor processing
Fully revised to cover the latest advances in the field, Microchip Fabrication , Sixth Editionexplains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.
State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technologicalbackbone of the high-tech industry.
COVERAGE INCLUDES:
The semiconductor industry
Properties of semiconductor materials and chemicals
Crystal growth and silicon wafer preparation
Wafer fabrication and packaging
Contamination control
Productivity and process yields
Oxidation
The ten-step patterning process--surface preparation to exposure; developing to final inspection
Next generation lithography
Doping
Layer deposition
Metallization
Process and device evaluation
The business of wafer fabrication
Devices and integrated circuit formation
Integrated circuits
Packaging
Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Fully revised to cover the latest advances in the field, Microchip Fabrication , Sixth Editionexplains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.
State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technologicalbackbone of the high-tech industry.
COVERAGE INCLUDES:
The semiconductor industry
Properties of semiconductor materials and chemicals
Crystal growth and silicon wafer preparation
Wafer fabrication and packaging
Contamination control
Productivity and process yields
Oxidation
The ten-step patterning process--surface preparation to exposure; developing to final inspection
Next generation lithography
Doping
Layer deposition
Metallization
Process and device evaluation
The business of wafer fabrication
Devices and integrated circuit formation
Integrated circuits
Packaging
Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.