Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
Produktdetails
Produktdetails
Woodhead Publishing Series in Electronic and Optical Materials
Dr. Hengyun Zhang is a professor in Shanghai University of Engineering Science. He has worked in industry and research institutes for 16 years, including Institute of Microelectronics (Singapore), Advanced Micro Devices and Dow Corning. He was the recipient of the Best Poster Paper award from ITHERM 2004, AMD Engineering Excellence Award 2008, and Best Paper award from Icept 2010. He has nearly 70 publications in international journals and conferences, and more than 24 patents granted/filed of thermal and packaging significance. He also served in a number of international conferences as a committee member (ITHERM, ICEPT, EPTC, MNHMT etc). He was a speaker in IME Industry Forums on thermal packaging and the project leader for more than ten research projects. His current interests include thermal management and electronics packaging.
Dr. Faxing Che is a scientist with the Institute of Microelectronics (IME), Agency for Science, Technology and Research (A-star), Singapore. He has 13-years' experience in the design-for-reliability for advanced electronics packaging. He was a Senior R&D Engineer with the United Test and Assembly Centre and ST Microelectronics for three years, and a Staff Engineer with Infineon Technologies Singapore for two years. He has authored and co-authored more than 120 technical papers in refereed journals and conferences. His current research interests include design for reliability in wafer-level, chip scale packaging, and 3-D advanced packaging, Cu wire bonding, Fan-out WLP, finite-element modeling and characterization of microelectronics packaging materials.
Inhaltsangabe
1. Introduction 2. Electrical modeling and design 3. Thermal modeling, analysis, and design 4. Stress and reliability analysis for interconnects 5. Reliability and failure analysis of encapsulated packages 6. Thermal and mechanical tests for packages and materials 7. System-level modeling, analysis, and design
1. Introduction 2. Electrical modeling and design 3. Thermal modeling, analysis, and design 4. Stress and reliability analysis for interconnects 5. Reliability and failure analysis of encapsulated packages 6. Thermal and mechanical tests for packages and materials 7. System-level modeling, analysis, and design
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