Nakhla

Modeling and Simulation of High Speed VLSI Interconnects

A Special Issue of Analog Integrated Circuits and Signal Processing An International Journal Vol. 5, No. 1 (1994)
Herausgegeben:Nakhla, Michel S.; Zhang, Q. J.

• Gebundenes Buch

Produktbeschreibung

Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area.
Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.

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Produktdetails

• Verlag: Springer / Springer US / Springer, Berlin
• Artikelnr. des Verlages: 978-0-7923-9441-9
• Reprinted from ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 5:1, 1994
• Seitenzahl: 108
• Erscheinungstermin: 31. Januar 1994
• Englisch
• Abmessung: 260mm x 183mm x 11mm
• Gewicht: 435g
• ISBN-13: 9780792394419
• ISBN-10: 0792394410
• Artikelnr.: 23413485

Inhaltsangabe

Guest Editors' Introduction.- Efficient Transient Analysis of Nonlinearly Loaded Low-Loss Multiconductor Interconnects.- A Simplified Synthesis of Transmission Lines with a Tree Structure.- An Interconnect Model for Arbitrary Terminations Based on Scattering Parameters.- Electromagnetic Analysis of Multiconductor Losses and Disperion in High-Speed Interconnects.- Circuit Modeling of General Hybrid Uniform Waveguide Structures in Chiral Anisotropic Inhomogeneous Media.- An Efficient, CAD-Oriented Model for the Characteristic Parameters of Multiconductor Buses in High-Speed Digital GaAs ICs.- Full-Wave Analysis of Radiation Effect of Microstrip Transmission Lines.- Optimizing VLSI Interconnect Model for SPICE Simulation.- Statistical Simulation and Optimization of High-Speed VLSI Interconnects.