110,99 €
inkl. MwSt.
Versandkostenfrei*
Versandfertig in 6-10 Tagen
payback
55 °P sammeln
  • Gebundenes Buch

A lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. This book provides the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique.

Produktbeschreibung
A lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. This book provides the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique.
Autorenporträt
Andreas Öchsner, born 1970, is Full Professor in the Department Solid Mechanics and Design at the University of Technology Malaysia (UTM), Malaysia and Head of the Advanced Materials and Structure Lab. Having obtained a Diploma Degree (Dipl.-Ing.) in Aeronautical Engineering at the University of Stuttgart (1997), Germany, he spent the time from 1997-2003 at the University of Erlangen-Nuremberg as a research and teaching assistant to obtain his Doctor of Engineering Sciences (Dr.-Ing.). From 2003-06, he worked as Assistant Professor in the Department of Mechanical Engineering and Head of the Cellular Metals Group affiliated with the University of Aveiro, Portugal. His research interests are related to experimental and computational mechanics, cellular metals and thin structures and interphases. His research activities were recognised in 2010 by the award of a higher doctorate degree (D.Sc.) by the University of Newcastle, Australia.

Lucas F. M. da Silva is currently Assistant Professor at the Faculty of Engineering of the University of Porto. He received a PhD related to adhesive bonding in 2004 from the University of Bristol under the supervision of Prof RD Adams. Since then, he has been teaching and investigating structural adhesive joints. The work covers a wide range of engineering structural adhesives such as epoxies, acrylics and bismaleimides. Several test methods for adhesive joints are available at the FEUP including various joint configurations such as bulk specimens, lap shear joints and butt joints. In addition to the experimental expertise, detailed analytical models and finite element analysis of stresses and strains within the joints are also undertaken.
In 2005 he joined the editorial board of the "International Journal of Adhesion and Adhesives".