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This book is discussing about the usage of nanofluid as a coolant for electronic devices. Nanofluids are the suspension of solid nanoparticles in a base fluid. Nanofluids are expected to be a promising coolant candidate for thermal management system of next generation high heat dissipation electronic systems. In this research, thermal conductivity, heat transfer and pumping power for a nanofluid turbulent flow in copper minichannel heat sink is analyzed. Nanofluids with a different volume fraction and with 2 m/s and 6m/s inlet velocities are used.A minichannel heat sink with the bottom…mehr

Produktbeschreibung
This book is discussing about the usage of nanofluid as a coolant for electronic devices. Nanofluids are the suspension of solid nanoparticles in a base fluid. Nanofluids are expected to be a promising coolant candidate for thermal management system of next generation high heat dissipation electronic systems. In this research, thermal conductivity, heat transfer and pumping power for a nanofluid turbulent flow in copper minichannel heat sink is analyzed. Nanofluids with a different volume fraction and with 2 m/s and 6m/s inlet velocities are used.A minichannel heat sink with the bottom analyzed for SiC water nanofluid and TiO2 water nanofluid turbulent flow as a coolant through hydraulics diameters and heat flux boundary condition are assumed.
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Autorenporträt
Currently, Ali Ijam is a PhD student at the University of Malaya, working on nanofluid and heat transfer filed. He obtained a B.Sc. degree in Materials Engineering form university of Babylon, Iraq and master of Engineering in Mechanical form University of Malaya, Malaysia.