Optimizing diffusion bonding parameters for Ti-6Al-4V/AISI304 joints - A, Arun Negemiya;s, Rajakumar;v, Balasubramanian
26,99 €
inkl. MwSt.
Versandkostenfrei*
Versandfertig in 6-10 Tagen
payback
13 °P sammeln
  • Broschiertes Buch

High-temperature alloys have turned strategically important in aerospace applications due to their high strength to weight ratio and corrosion resistance. The joining of high-temperature materials such as titanium alloys, austenitic stainless-steel alloys in aerospace industries offers main benefits of near net shape manufacturing and of reduction in buy to fly ratio. Among the various joining methods, diffusion bonding has been a widely accepted technique to join high-temperature alloys to produce complex structures with reduced weight and fabrication costs compared to mechanically fastened…mehr

Andere Kunden interessierten sich auch für
Produktbeschreibung
High-temperature alloys have turned strategically important in aerospace applications due to their high strength to weight ratio and corrosion resistance. The joining of high-temperature materials such as titanium alloys, austenitic stainless-steel alloys in aerospace industries offers main benefits of near net shape manufacturing and of reduction in buy to fly ratio. Among the various joining methods, diffusion bonding has been a widely accepted technique to join high-temperature alloys to produce complex structures with reduced weight and fabrication costs compared to mechanically fastened structures. The bonding process is mainly optimized for high-temperature materials (Ti-6Al-4V, AISI 304) to produce defect-free joints. However, very limited research has been conducted on joining high-temperature dissimilar materials.
Autorenporträt
He completed his B.E and M.E in Aeronautical Engineering and he has done his Ph.D. in Manufacturing Engineering. He has published 4 papers in international journals and 13 presentations in both national and international conferences. He has 4 years of experience in research and his area of interest is materials joining and diffusion bonding.