This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
Produktdetails
Produktdetails
Micro- and Opto-Electronic Materials, Structures, and Systems
Artikelnr. des Verlages: 86304627, 978-1-4614-9262-7
2015
Seitenzahl: 420
Erscheinungstermin: 15. Juli 2014
Englisch
Abmessung: 241mm x 160mm x 29mm
Gewicht: 674g
ISBN-13: 9781461492627
ISBN-10: 1461492629
Artikelnr.: 39353100
Autorenporträt
Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi'an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.
Inhaltsangabe
Introduction of High Power Semiconductor Lasers.- Overview of High Power Semiconductor Laser Packages.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress in High Power Semiconductor Lasers.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Packaging Process of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
Introduction of High Power Semiconductor Lasers.- Overview of High Power Semiconductor Laser Packages.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress in High Power Semiconductor Lasers.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Packaging Process of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
Es gelten unsere Allgemeinen Geschäftsbedingungen: www.buecher.de/agb
Impressum
www.buecher.de ist ein Shop der buecher.de GmbH & Co. KG Bürgermeister-Wegele-Str. 12, 86167 Augsburg Amtsgericht Augsburg HRA 13309