Hui Liu, Xingsheng Liu, Lingling Xiong

Packaging of High Power Semiconductor Lasers

• Gebundenes Buch

Produktbeschreibung

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Produktdetails

• Micro- and Opto-Electronic Materials, Structures, and Systems
• Verlag: Springer / Springer New York / Springer, Berlin
• Artikelnr. des Verlages: 86304627, 978-1-4614-9262-7
• 2015
• Seitenzahl: 420
• Erscheinungstermin: 15. Juli 2014
• Englisch
• Abmessung: 241mm x 160mm x 29mm
• Gewicht: 813g
• ISBN-13: 9781461492627
• ISBN-10: 1461492629
• Artikelnr.: 39353100

Autorenporträt

Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi'an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.

Inhaltsangabe

Introduction of High Power Semiconductor Lasers.- Overview of High Power Semiconductor Laser Packages.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress in High Power Semiconductor Lasers.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Packaging Process of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.- Development Trend and Challenges in High Power Semiconductor Laser Packaging.