Xingsheng Liu, Wei Zhao, Lingling Xiong

Broschiertes Buch

Packaging of High Power Semiconductor Lasers

Beschreibung

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Autor

Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi¿an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.

Produktdetails

• Micro- and Opto-Electronic Materials, Structures, and Systems
• Verlag: Springer / Springer New York / Springer, Berlin
• Artikelnr. des Verlages: 978-1-4939-5590-9
• Softcover reprint of the original 1st ed. 2015
• Seitenzahl: 420
• Erscheinungstermin: 1. Oktober 2016
• Englisch
• Abmessung: 235mm x 155mm x 22mm
• Gewicht: 710g
• ISBN-13: 9781493955909
• ISBN-10: 149395590X
• Artikelnr.: 45752744