Engineering design teams sometimes have need of a material that may not exist because the combination of required properties is difficult to achieve. One solution is to develop a new material having the required set of properties needed in the application. During his 40-year career, author Ralph Hermansen has successfully worked on many such problems. In this book he presents twenty of those design problems and the solutions, which resulted in patents and spin-off applications. He draws on his years of hands-on experience to cover polymeric compounds such as coatings, adhesives, encapsulants, transparent plastics, and others.…mehr
Engineering design teams sometimes have need of a material that may not exist because the combination of required properties is difficult to achieve. One solution is to develop a new material having the required set of properties needed in the application. During his 40-year career, author Ralph Hermansen has successfully worked on many such problems. In this book he presents twenty of those design problems and the solutions, which resulted in patents and spin-off applications. He draws on his years of hands-on experience to cover polymeric compounds such as coatings, adhesives, encapsulants, transparent plastics, and others.Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Ralph D. Hermansen was formerly Senior Scientist at Hughes Aircraft Company in El Segundo, California. He was very active in the Society for the Advancement of Materials and Processes Engineering (SAMPE) and has presented papers annually and attended many seminars and sessions. He has 21 patent awards and won best inventor award in 1991 from Hughes Aircraft Company. He has taught courses at HAC as an instructor in their Advanced Technical Education Program (ATEP) for several years materials engineering and Pascal Programming Language and is the author of Formulating Plastics and Elastomers by Computer (Elsevier). Mr. Hermansen was known nationwide as one to see with challenging material problems. Anxious clients, from as far across the continent, traveled to seek his help with "unsolvable problems." He currently reviews books in his field.
Inhaltsangabe
Preface. Custom Formulating. Materials and Process Engineering. The Art and Science of Formulating. Thermal Transfer Adhesives for Space Electronics. Thermal Transfer Filleting Adhesives. Flexible Epoxy Thermal Transfer Adhesives for Flatpacks. More About the New Thermal Transfer Adhesives. Superior Thermal Transfer Adhesive. Other Custom Formulated Compounds for Aerospace Electronics Applications. Radio Opaque Adhesive/Sealant. Low Exotherm, Low Temperature Curing Epoxy Impregnants. Platable Adhesives for Cyanate Ester Composites. Reworkable, Thermally Conductive Adhesives for Electronic Assemblies. Room Temperature Stable, One Component, Flexible Epoxy Adhesives. Custom Formulated Compounds for Automotive Electronics Applications. Air Bag Sensor Encapsulation. Reactive Hot Melt Conformal Coating Materials. Solder Joint Lead Encapsulation. Custom Formulated Organic Solder to Eliminate Lead. Formulation of a Drop Resistant Organic Solder. Rigid Polyurethanes for Aircraft Transparencies. Sierraclad(TM) Bird Proof Canopies and Windshields. Three Niche Technologies. Flexipoxy Technology. Hacthane Technology. Transparent Polyurethane Plastics. Spin Off Applications. Spin off from Our Thermal Transfer Adhesives Patents. Spin off from Our Electrically Conductive Adhesives Patents. Spin off from Our Encapsulants, Potting Compounds and Impregnants Patents. Spin Off from Our High Volume Electronic Assembly Materials Patents. Spin off from Our Specialty Adhesives Patents. Spin off from Our Specialty Rigid Thermosets Patents. Appendix I: The Science of Rubbery Materials. Index.
Preface. Custom Formulating. Materials and Process Engineering. The Art and Science of Formulating. Thermal Transfer Adhesives for Space Electronics. Thermal Transfer Filleting Adhesives. Flexible Epoxy Thermal Transfer Adhesives for Flatpacks. More About the New Thermal Transfer Adhesives. Superior Thermal Transfer Adhesive. Other Custom Formulated Compounds for Aerospace Electronics Applications. Radio Opaque Adhesive/Sealant. Low Exotherm, Low Temperature Curing Epoxy Impregnants. Platable Adhesives for Cyanate Ester Composites. Reworkable, Thermally Conductive Adhesives for Electronic Assemblies. Room Temperature Stable, One Component, Flexible Epoxy Adhesives. Custom Formulated Compounds for Automotive Electronics Applications. Air Bag Sensor Encapsulation. Reactive Hot Melt Conformal Coating Materials. Solder Joint Lead Encapsulation. Custom Formulated Organic Solder to Eliminate Lead. Formulation of a Drop Resistant Organic Solder. Rigid Polyurethanes for Aircraft Transparencies. Sierraclad(TM) Bird Proof Canopies and Windshields. Three Niche Technologies. Flexipoxy Technology. Hacthane Technology. Transparent Polyurethane Plastics. Spin Off Applications. Spin off from Our Thermal Transfer Adhesives Patents. Spin off from Our Electrically Conductive Adhesives Patents. Spin off from Our Encapsulants, Potting Compounds and Impregnants Patents. Spin Off from Our High Volume Electronic Assembly Materials Patents. Spin off from Our Specialty Adhesives Patents. Spin off from Our Specialty Rigid Thermosets Patents. Appendix I: The Science of Rubbery Materials. Index.
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