Dave S Steinberg

Preventing Thermal Cycling and Vibration Failures in Electronic Equipment

• Gebundenes Buch

Produktbeschreibung

This book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature.

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Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.

Produktdetails

• Verlag: Wiley
• Seitenzahl: 304
• Erscheinungstermin: 11. Juli 2001
• Englisch
• Abmessung: 240mm x 161mm x 21mm
• Gewicht: 627g
• ISBN-13: 9780471357292
• ISBN-10: 0471357294
• Artikelnr.: 22346967

Autorenporträt

Dave S. Steinberg is the author of Preventing Thermal Cycling and Vibration Failures in Electronic Equipment, published by Wiley.

Inhaltsangabe

Preface.
Symbols.
Physics of Failure In Electronic Systems.
Thermal Expansion Displacements, Forces, and Stresses.
Vibration of Beams and Other Simple Structures.
Vibration of Printed Circuit Boards and Flat Plates.
Estimating Fatigue Life in Thermal Cycling and VibrationEnvironments.
Octave Rule, Snubbers, Dampers, and Isolation for PreventingVibration
Damage to Electronic Systems.
Displacements, Forces, and Stresses in Axial Leaded ComponentWires Due to
Thermal Expansions.
Designing Electronic Equipment for Sinusoidal Vibration.
Assessment of Random Vibration on Electronic Design.
Combining Fatigue Damage for Random Vibration and Thermal Cycling.
Thermal Cycling Failures in Surface-Mounted Components.
Stresses and Fatigue Life in Component Lead Wires and SolderJoints Due to
Dynamic Forces and PCB Displacements.
Fatigue Life of Long Components, Tall Components, and SmallComponents
Mounted on PCBs.
Wear and Interface Surface Fretting Corrosion in ElectricalConnectors.
Case Histories of Failures and Failure Analyses.
Bibliography.
Index.